Wireless charging coil PCB structure

Patent metadata

Field	Value
Publication number	US-9595383-B2
Application number	US-201514605601-A
Country	US
Kind code	B2
Filing date	Jan 26, 2015
Priority date	Oct 31, 2014
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.

First claim

What is claimed is:

1. A wireless charging coil PCB structure, comprising:
at least one first coil arranged on a first layer of a printed circuit board (PCB), the first layer having a first non-coil region on which the first coil is not arranged, the first non-coil region being on center or peripheral of the first coil;
at least one second coil arranged on a second layer of the PCB, the second layer having a second non-coil region on which the second coil is not arranged, the second non-coil region being on center or peripheral of the second coil;
a plurality of first conductive wires arranged on the first non-coil region and corresponding to partial wires of the second coil, a plurality of electric contacts arranged between the first conductive wires and the partial wires of the second coil and passing from the first layer to the second layer, the electric contacts electrically connecting the first conductive wires and the partial wires of the second coil in parallel;
a plurality of second conductive wires arranged on the second non-coil region and corresponding to partial wires of the first coil, a plurality of electric contacts arranged between the second conductive wires and the partial wires of the first coil and passing from the first layer to the second layer, the electric contacts electrically connecting the second conductive wires and the partial wires of the first coil in parallel;
at least one third coil arranged on a third layer of the PCB, the third layer having a third non-coil region on which the third coil is not arranged, the third non-coil region being on center or peripheral of the third coil; partial wires of the third coil being corresponding to the second conductive wires, a plurality of electric contacts arranged between the second conductive wires and the partial wires of the third coil and passing from the second layer to the third layer, the electric contacts electrically connecting the second conductive wires and the partial wires of the second coil in parallel; and
a plurality of third conductive wires arranged on the third non-coil region and corresponding to the partial wires of the second coil, a plurality of electric contacts arranged between the third conductive wires and the partial wires of the second coil and passing from the second layer to the third layer, the electric contacts electrically connecting the third conductive wires and the partial wires of the second coil in parallel.

2. The wireless charging coil PCB structure in claim 1 , wherein the first layer of the PCB is a topmost layer of the PCB, and the second layer is the bottommost layer of the PCB.

3. The wireless charging coil PCB structure in claim 1 , further comprising:
at least one fourth coil arranged on a fourth layer of the PCB, the fourth layer having a fourth non-coil region on which the fourth coil is not arranged, the fourth non-coil region being on center or peripheral of the fourth coil; partial wires of the fourth coil being corresponding to the third conductive wires, a plurality of electric contacts arranged between the third conductive wires and the partial wires of the fourth coil and passing from the third layer to the fourth layer, the electric contacts electrically connecting the third conductive wires and the partial wires of the fourth coil in parallel; and
a plurality of fourth conductive wires arranged on the fourth non-coil region and corresponding to the partial wires of the third coil, a plurality of electric contacts arranged between the fourth conductive wires and the partial wires of the third coil and passing from the third layer to the fourth layer, the electric contacts electrically connecting the fourth conductive wires and the partial wires of the third coil in parallel.

4. The wireless charging coil PCB structure in claim 3 , wherein the first layer of the PCB is a topmost layer of the PCB, the second layer and the third layer are inter layers of the PCB and the fourth layer is the bottommost layer of the PCB.

5. The wireless charging coil PCB structure in claim 3 , wherein the electric contacts are arranged at both ends of each one of the first conductive wires, the second conductive wires, the third conductive wires or the fourth conductive wires.

6. The wireless charging coil PCB structure in claim 3 , wherein the electric contacts are arranged at a center of each one of the first conductive wires, the second conductive wires, the third conductive wires or the fourth conductive wires.

7. The wireless charging coil PCB structure in claim 3 , wherein the first coil, the second coil, the third coil or the fourth coil has a winding shape of rectangular shape, circular shape, elliptical shape, or polygonal shape.

8. The wireless charging coil PCB structure in claim 3 , wherein the first coil, the second coil, the third coil and the fourth coil have different shapes and sizes.

9. The wireless charging coil PCB structure in claim 3 , wherein the PCB is arranged on a ferrite plate.

Assignees

• Tdk Taiwan Corp

Inventors

• Chien Feng-Lung
• Oishi Takahiro
• Burket Chris T
• Chang Chao-Neen
• Wu Alan

Classifications

• H02J50/005 Primary

  Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices · CPC title

• H02J7/70

  characterised by the mechanical construction · CPC title

• H01F27/2804

  Printed windings · CPC title

• H02J50/10

  using inductive coupling · CPC title

• H01F2027/2809

  on stacked layers · CPC title