Ceramic electronic component and method of manufacturing the same

US9595375B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9595375-B2
Application numberUS-201414305096-A
CountryUS
Kind codeB2
Filing dateJun 16, 2014
Priority dateJun 19, 2013
Publication dateMar 14, 2017
Grant dateMar 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.

First claim

Opening claim text (preview).

What is claimed is: 1. A ceramic electronic component having an outer dimension of a length not smaller than about 0.57 mm and not greater than about 0.65 mm, a width not smaller than about 0.27 mm and not greater than about 0.35 mm, and a thickness not smaller than about 0.27 mm and not greater than about 0.35 mm, the ceramic electronic component comprising: a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked; and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode; wherein the external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component; and a volume occupied by the resin component in the inner external electrode is not lower than about 3.79×10 −7 ml and not higher than about 1.02×10 −6 ml. 2. A ceramic electronic component having an outer dimension of a length not smaller than about 0.95 mm and not greater than about 1.20 mm, a width not smaller than about 0.45 mm and not greater than about 0.70 mm, and a thickness not smaller than about 0.45 mm and not greater than about 0.70 mm, the ceramic electronic component comprising: a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked; and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode; wherein the external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component; and a volume occupied by the resin component in the inner external electrode is not lower than about 5.23×10 −7 ml and not higher than about 2.53×10 −6 ml. 3. A ceramic electronic component having an outer dimension of a length not smaller than about 1.5 mm and not greater than about 1.8 mm, a width not smaller than about 0.7 mm and not greater than about 1.0 mm, and a thickness not smaller than about 0.7 mm and not greater than about 1.0 mm, the ceramic electronic component comprising: a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked; and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode; wherein the external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component; and a volume occupied by the resin component in the inner external electrode is not lower than about 1.94×10 −6 ml and not higher than about 2.84×10 −6 ml. 4. The ceramic electronic component according to claim 1 , wherein the metal component of the inner external electrode includes a first metal component and a second metal component higher in melting point than the first metal component. 5. The ceramic electronic component according to claim 4 , wherein the first metal component is Sn. 6. The ceramic electronic component according to claim 4 , wherein the second metal component is Ag or Cu. 7. The ceramic electronic component according to claim 1 , wherein the metal component of the outer external electrode is Ni.

Assignees

Inventors

Classifications

  • Thermally variable · CPC title

  • Surface mounted devices · CPC title

  • electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

  • with stacked layers · CPC title

  • Piezoelectric device making · CPC title

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What does patent US9595375B2 cover?
A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of t…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01C7/008. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).