Holding device, method of determining attraction abnormality in holding device, lithography apparatus, and method of manufacturing article
US-2024393682-A1 · Nov 28, 2024 · US
US9594301B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9594301-B2 |
| Application number | US-201213649448-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 11, 2012 |
| Priority date | Oct 14, 2011 |
| Publication date | Mar 14, 2017 |
| Grant date | Mar 14, 2017 |
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An imprint apparatus that transfers a pattern formed on a mold onto a resin on a substrate. A light irradiation unit irradiates the resin with light to cure the resin. A shape correction mechanism applies a force to the mold to deform a pattern region formed on the mold. A heating mechanism heats a substrate-side pattern region formed on the substrate to deform the substrate-side pattern region. A control unit obtains information regarding a difference between shapes of the pattern region formed on the mold and the substrate-side pattern region and controls the shape correction mechanism and the heating mechanism so as to reduce the difference between the shapes of the pattern region formed on the mold and the substrate-side pattern region based on the obtained information. The control unit controls a temperature distribution in the substrate-side pattern region by using the heating mechanism.
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What is claimed is: 1. An imprint apparatus that forms a pattern of a resin on a substrate-side pattern region of a substrate by using a mold, the imprint apparatus comprising: a first mechanism configured to apply a force to the mold to thereby deform a mold-side pattern region of the mold; a second mechanism configured to irradiate only a partial region of the substrate corresponding to the substrate-side pattern region with light that has passed through the mold, and capable of changing an illuminance distribution of an irradiation region of the light; and a control unit configured to obtain shape difference information between the mold-side pattern region and the substrate-side pattern region, and to control the force and the illuminance distribution based on the obtained shape difference information. 2. The imprint apparatus according to claim 1 , further comprising a detection unit configured to detect a plurality of marks formed on the mold and a plurality of marks formed on the substrate, wherein the control unit is configured to obtain the information based on a result detected by the detection unit. 3. The imprint apparatus according to claim 2 , wherein the detection unit measures at least four marks formed on the mold and at least four marks formed on the substrate. 4. The imprint apparatus according to claim 1 , wherein the second mechanism comprises a light source and heats the substrate-side pattern region by irradiating the substrate with light emitted from the light source. 5. The imprint apparatus according to claim 1 , wherein a wavelength of light irradiated onto the substrate using the second mechanism is within a range of 400 nm to 2000 nm. 6. The imprint apparatus according to claim 1 , wherein the control unit is configured to control the heating mechanism in a state in which the resin on the substrate is brought into contact with the mold. 7. The imprint apparatus according to claim 1 , wherein the control unit is configured to cause the second mechanism to deform the substrate-side pattern region after the pattern region formed on the mold is deformed by the first mechanism or during the deformation of the pattern region formed on the mold by the first mechanism. 8. The imprint apparatus according to claim 1 , wherein the partial region is irradiated with light of an uneven illuminance distribution to generate an uneven temperature distribution within the partial region by the second mechanism. 9. The imprint apparatus according to claim 1 , wherein the control unit is configured to calculate a correction amount by the first mechanism and the second mechanism for the substrate-side pattern regions. 10. The imprint apparatus according to claim 1 , wherein the control unit is configured to control a temperature distribution in the substrate-side pattern region by heating the substrate-side pattern region and an outside region, which is outside of the substrate-side pattern region and next to the substrate-side pattern region, by using the second mechanism. 11. The imprint apparatus according to claim 1 , wherein the control unit is configured to control the second mechanism to irradiate the substrate with light of a second irradiation dose per unit time that is lower than a first irradiation dose per unit time, after the substrate is irradiated with the light of the first irradiation dose. 12. The imprint apparatus according to claim 1 , wherein the control unit is configured to analyze deformation components included in the substrate-side pattern region based on the shape difference information and to control the temperature distribution in the substrate-side pattern region by using a correction amount corresponding to each of the deformation components obtained by a result of the analyzing. 13. The imprint apparatus according to claim 1 , wherein the second mechanism comprises an optical adjustor configured to adjust an illumination distribution of the light irradiated to the substrate-side pattern region. 14. The imprint apparatus according to claim 1 , wherein the control unit is configured to control the force and the illuminance distribution, based on the obtained shape difference information, so as to reduce the shape difference. 15. The imprint apparatus according to claim 1 , wherein an uncured resin on the substrate-side pattern region is cured by receiving ultraviolet light and is not cured by receiving light irradiated onto the substrate using the second mechanism.
characterised by the shape of the surface · CPC title
Manufacture or treatment of nanostructures · CPC title
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title
of layered or coated substantially flat surfaces · CPC title
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