LED package and a backlight unit comprising said LED package

Patent metadata

Field	Value
Publication number	US-9594207-B2
Application number	US-201514668295-A
Country	US
Kind code	B2
Filing date	Mar 25, 2015
Priority date	Jul 3, 2008
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

First claim

What is claimed is:

1. A light emitting diode (LED) package comprising:
a main body configured to be mounted on a board, the main body having an opening formed therein;
a light emitting diode (LED) mounted on the main body and emitting light; and
a lead frame having portions thereof exposed to allow the main body to be selectively top-mounted or side-mounted,
wherein the lead frame extends along at least three sides of the main body that contact each other,
wherein portions of the lead frame that extend along the at least three sides of the main body demarcate an area including the LED,
wherein the lead frame comprises:
a top electrode configured to be electrically connectable to the board to allow the LED to be mounted to be parallel to a front surface of the board such that the main body is top-mounted on the board;
a bent portion integrally formed with the top electrode and bent in a different direction to that of the top electrode; and
a side electrode formed at an end portion of the bent portion and configured to be electrically connectable to the board to allow the LED to be mounted to be perpendicular with respect to the board such that the main body is side-mounted on the board,

wherein the lead frame is bent to be inwardly recessed toward an interior of the main body to have an inwardly recessed portion for receiving the LED therein, and
wherein a rear surface of the inwardly recessed portion of the lead frame is exposed outwardly of a rear surface of the main body, and the inwardly recessed portion and the LED received therein are exposed outwardly of a front surface of the main body through the opening.

2. The LED package of claim 1 , wherein the side electrode is mounted on one side of the main body.

3. The LED package of claim 2 , wherein the top electrode is formed in an elongated manner on a lower surface of the main body.

4. The LED package of claim 1 , wherein the top electrode is mounted on one side of the main body.

5. The LED package of claim 4 , wherein the side electrode is formed in an elongated manner on the other side of the main body.

6. A light emitting diode (LED) package comprising:
a main body configured to be mounted on a board, the main body having an opening formed therein;
an LED mounted on the main body;
a lead frame having portions thereof exposed to allow the main body to be selectively top-mounted or side-mounted; and
a contact portion formed on a surface of the main body and providing a mounting area for mounting the main body on the board,
wherein the lead frame extends along at least three sides of the main body that contact each other,
wherein portions of the lead frame that extend along the at least three sides of the main body demarcate an area including the LED,
wherein the lead frame comprises:
a top electrode configured to be electrically connectable to the board to allow the LED to be mounted to be parallel to a front surface of the board such that the main body is top-mounted on the board;
a bent portion integrally formed with the top electrode and bent in a different direction to that of the top electrode; and
a side electrode formed at an end portion of the bent portion and configured to be electrically connectable to the board to allow the LED to be mounted to be perpendicular with respect to the board such that the main body is side-mounted on the board,

wherein the lead frame is bent to be inwardly recessed toward an interior of the main body to have an inwardly recessed portion for receiving the LED therein, and
wherein a rear surface of the inwardly recessed portion of the lead frame is exposed outwardly of a rear surface of the main body, and the inwardly recessed portion and the LED received therein are exposed outwardly of a front surface of the main body through the opening.

7. The LED package of claim 6 , wherein the contact portion is formed at a central portion of the main body.

8. The LED package of claim 6 , wherein the contact portion is mounted on a side of the main body and has an end bent toward the board.

9. The LED package of claim 6 , wherein the contact portion and the lead frame are integrally formed.

10. A light emitting diode (LED) package comprising:
a main body, the main body having an opening;
an LED mounted in the main body and emitting light; and
a lead frame comprising:
a first lead part on which the LED is mounted, and
a side electrode provided on a first side of the main body, perpendicular with respect to the first lead part, wherein the side electrode is electrically connected to the first lead part, and is exposed to be electrically connectable to a board such that the main body is side-mountable on the board to perpendicularly dispose the LED to the board,

wherein portions of the lead frame that extend along the at least three sides of the main body define an area including the LED,
wherein the first lead part is bent to be inwardly recessed toward an interior of the main body to have an inwardly recessed portion for receiving the LED therein, and a rear surface of the inwardly recessed portion of the first lead part is exposed outwardly of a rear surface of the main body, and the inwardly recessed portion and the LED received therein are exposed outwardly of a front surface of the main body through the opening,
wherein the lead frame further comprises a top portion along a second side of the main body, perpendicular with respect to the first side,
wherein the top portion is electrically connected to the first lead part by electrically conductive wiring, and
wherein the top portion is a top electrode exposed to be electrically connectable to the board such that the main body is top-mountable on the board.

11. The LED package of claim 10 , wherein:
the lead frame further comprises a bent portion integrally formed with the top electrode and bent toward a different side from the top electrode and from the first side; and
the side electrode is at an end of the top portion.

12. The LED package of claim 11 , wherein the side electrode, the bent portion, and the top electrode are integrally formed.

13. The LED package of claim 12 , wherein the side electrode is mounted on one side of the main body.

14. The LED package of claim 13 , wherein the top electrode is formed in an elongated manner on a lower surface of the main body.

15. The LED package of claim 10 , wherein the side electrode is connected to the first side of the main body and is separated from the first lead part.

16. The LED package of claim 15 , wherein the lead frame further comprises another side electrode along the first side of the main body and exposed to be electrically connectable to the board such that the main body is side-mountable on the board to perpendicularly dispose the LED with respect to the board, wherein the other side electrode is separated from the side electrode and is connected to the first lead part.

17. The LED package of claim 15 , wherein the lead frame further comprises a second lead part, parallel to the first lead part along a same side of the main body, separated from the first lead part and connected to the side electrode.

18. A backlight unit comprising:
a light guide plate configured to allow a light to proceed to a liquid crystal panel; and
a light emitting diode (LED) package comprising:
a main body mounted on a board, the main body having an opening formed therein,
an LED mounted on the main body and generating light, and
a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted,

wherein t

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Geun-Young
• Onishi Tomohisa
• Lee Jung-Hun
• Kim Young-Taek
• Park Jong-Jin
• Yun Mi-Jeong
• Park Young-Sam
• Hahm Hun-Joo
• Kim Hyung-Suk
• Han seong-yeon
• Kim Do-Hun
• Kim Dae-Yeon
• Kim Dae-Hyun
• Park Jung-Kyu

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• G02B6/0023

  provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source · CPC title

• G02B6/0073 Primary

  Light emitting diode [LED] · CPC title