Electrically conductive heat-activated adhesive compound

Patent metadata

Field	Value
Publication number	US-9593264-B2
Application number	US-201214236269-A
Country	US
Kind code	B2
Filing date	Jul 10, 2012
Priority date	Aug 10, 2011
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

First claim

The invention claimed is:

1. An adhesive film, bondable when heat-activated, comprising
a) a polymer-metal blend comprising
at least one adhesive, bondable when heat-activated, and
at least one metal component meltable in the temperature range from 50° C. to 400° C., and

b) at least one fibrous, electrically conductive filler,
wherein the at least one fibrous, electrically conductive filler is present, at least partly, in a form of a bound fiber network with the at least one metal component such that fibers of the at least one fibrous, electrically conductive filler are present in a form bound to one another by the at least one metal component, and
further wherein the at least one fibrous, electrically conductive filler comprises aluminum, copper, silver, gold, nickel, mu-metal, alnico, permalloy, ferrite, carbon nanotubes and graphene.

2. The adhesive film according to claim 1 , wherein fibers of the at least one fibrous, electrically conductive filler have an aspect ratio of at least 3, wherein the aspect ratio is a ratio between a greatest longitudinal extent and a small longitudinal extent of the fibers.

3. The adhesive film according to claim 2 , wherein the aspect ratio of the fibers is at least 10.

4. The adhesive film according to claim 2 , wherein fibers of the at least one fibrous, electrically conductive filler have a fiber length from 1 to 10 mm.

5. The adhesive film according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive fillers is a carbon modification or a carbon-containing chemical compound.

6. The adhesive film according to claim 5 , wherein the at least one fibrous, electrically conductive filler consists of copper-coated carbon fibers or nickel-coated carbon fibers.

7. The adhesive film according to claim 1 , wherein the at least one fibrous, electrically conductive filler comprises at least one selected from copper and nickel.

8. The adhesive film according to claim 7 , wherein the at least one fibrous, electrically conductive filler consists of coppered aluminum fibers or nickeled aluminum fibers.

9. The adhesive film according to claim 1 , wherein the fibers of the at least one fibrous and regions formed by the at least one metal component are aligned in a first direction or orientation.

10. The adhesive film according to claim 9 , wherein the first direction or orientation is substantially perpendicular to the plane of the adhesive film.

11. The adhesive film according to claim 1 , wherein the at least one metal component is a metal or a metal alloy.

12. The adhesive film according to claim 1 , wherein the at least one adhesive, bondable when heat-activated, is a heat-activatable thermoplastic adhesive.

13. The adhesive film according to claim 1 aims, wherein the at least one adhesive, bondable heat-activated, is a heat-activatable reactive adhesive.

14. The adhesive film according to claim 1 , wherein fibers of the at least one fibrous, electrically conductive filler have a fiber length between 0.1 and 0.9 mm.

15. The adhesive film according to claim 1 , wherein the fibers of the at least one fibrous have a thickness of at least 60 μm and no more than 180 μm.

16. A method for adhesive bonding on a first substrate surface, the method comprising:
bonding the first substrate by means of the adhesive film according to claim 1 , which is heat-activated for bonding on the first substrate.

17. The method according to claim 16 , further comprising:
bonding a surface of the first substrate to a surface of a second substrate by means of the adhesive film that has been heat-activated.

18. The method according to claim 17 , wherein
first of all the adhesive film is subjected to a preliminary fastening onto the surface of the first substrate, by the adhesive film being activated at a temperature below the melting temperature of the metal component; and
thereafter a final fixing is brought about, by the adhesive film being activated on the surface of the first substrate, or in a final disposition between the surfaces of the first and second substrates, at a temperature above the melting temperature of the metal component.

19. The method according to claim 16 , wherein the heat the activation of the adhesive film is performed at a temperature below the melting temperature of the metal component.

20. The method according to claim 16 , wherein the adhesive bonding is brought about by means of the adhesive film, which can be bonded when heat-activated, and the filler is oriented by means of a magnetic field before or during the activation.

Assignees

• KEITE-TELGENBüSCHER KLAUS
• Tesa Se

Inventors

• KEITE-TELGENBüSCHER KLAUS

Classifications

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• C08K3/08

  Metals · CPC title

• H05K3/321

  by conductive adhesives · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J2400/16

  Metal · CPC title