Ultrasonic imaging compression methods and apparatus

US9592032B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9592032-B2
Application numberUS-201514689080-A
CountryUS
Kind codeB2
Filing dateApr 17, 2015
Priority dateApr 18, 2014
Publication dateMar 14, 2017
Grant dateMar 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.

First claim

Opening claim text (preview).

What is claimed is: 1. An ultrasound device, comprising: at least one ultrasonic transducer element integrated on a semiconductor die; an analog to digital converter (ADC) integrated on the semiconductor die, wherein the ADC is configured to process a signal output from the at least one ultrasonic transducer element to produce a digital signal; and a compression circuit integrated on the semiconductor die and configured to generate a compressed signal by compressing the digital signal, wherein the compressed signal is configured to be transmitted from the semiconductor die as a data stream, wherein the compression circuit further comprises a filter, a decimation circuit, a re-quantization circuit, and an arithmetic logic unit (ALU), wherein an output of the filter is coupled to an input of the decimation circuit, an output of the decimation circuit is coupled to an input of the re-quantization circuit, and an output of the re-quantization circuit is coupled to an input of the ALU; and wherein the compression circuit is configured to generate the compressed signal prior to any image reconstruction process. 2. The ultrasound device of claim 1 , wherein the compression circuit includes quadrature demodulation circuitry and wherein the compression circuit is configured to compress the digital signal using the quadrature demodulation circuitry. 3. The ultrasound device of claim 1 , wherein the compression circuit includes down-sampling circuitry, and wherein the compression circuit is configured to compress the digital signal using the down-sampling circuitry. 4. The ultrasound device of claim 1 , wherein the filter includes a cascade integrating comb (CIC) filter, and wherein the compression circuit is configured to compress the digital signal using the CIC filter. 5. The ultrasound device of claim 1 , wherein the arithmetic logic unit is configured to perform at least one operation on the digital signal selected from the group consisting of extending a word size, bit shifting, accumulating, and subtracting. 6. The ultrasound device of claim 1 , further comprising an output interface configured to output the data stream from the semiconductor die. 7. The ultrasound device of claim 6 , wherein the output interface is a high-speed serial interface selected from the group consisting of a USB 3.0 interface, a USB 3.1 interface, a USB 2.0 interface, a Thunderbolt interface, a FireWire interface, and a Gigabit Ethernet interface. 8. The ultrasound device of claim 1 , wherein the compression circuit is configured to compress the digital signal based, at least in part, on a mode of operation of the ultrasound device. 9. The ultrasound device of claim 1 , further comprising image reconstruction circuitry configured to perform at least a portion of an image reconstruction process based, at least in part, on the compressed signal. 10. The ultrasound device of claim 9 , wherein the image reconstruction circuitry is configured to perform at least a portion of an image reconstruction process using a beamforming technique. 11. The ultrasound device of claim 10 , wherein the beamforming technique comprises using an integrated backprojection technique, in which at least one of receiver time-of-flight values and receive apodization values are reused within consecutive scans. 12. The ultrasound device of claim 1 , further comprising a memory integrated on the semiconductor die, the memory configured to selectively store the digital signal prior to the digital signal being compressed by the compression circuit. 13. A method for processing a signal output from an ultrasonic transducer element, comprising: with a component integrated on a same semiconductor die as the ultrasonic transducer element, processing the signal output from the ultrasonic transducer element to produce a digital signal; and with at least one additional component integrated on the semiconductor die, producing a compressed signal by compressing the digital signal, wherein the compressed signal is configured to be transmitted from the semiconductor die as a data stream, wherein compressing the digital signal comprises filtering the digital signal with a filter integrated on the semiconductor die to produce a filtered signal, decimating the filtered signal with a decimation circuit integrated on the semiconductor die to produce a decimated signal, re-quantizing the decimated signal with a re-quantization circuit integrated on the semiconductor die to produce a re-quantized signal, and processing the re-quantized signal with an arithmetic logic unit (ALU) integrated on the semiconductor die; and wherein the compressed signal is produced prior to any image reconstruction process. 14. The method of claim 13 , wherein compressing the digital signal comprises performing quadrature demodulation on the digital signal. 15. The method of claim 13 , wherein compressing the digital signal comprises down-sampling the digital signal. 16. The method of claim 13 , wherein filtering the digital signal comprises filtering the digital signal using a cascade integrated comb (CIC) filter integrated on the semiconductor die. 17. The method of claim 13 , wherein processing the re-quantized signal using the arithmetic logic unit comprises performing at least one operation on the re-quantized signal selected from the group consisting of extending a word size, bit shifting, accumulating, and subtracting. 18. The method of claim 13 , further comprising outputting the data stream from the semiconductor die via an output interface. 19. The method of claim 18 , wherein the output interface is a high-speed serial interface selected from the group consisting of a USB 3.0 interface, a USB 3.1 interface, a USB 2.0 interface, a Thunderbolt interface, a FireWire interface, and a Gigabit Ethernet interface. 20. The method of claim 13 , wherein compressing the digital signal comprises compressing the digital signal based, at least in part, on a mode of operation of a device including the ultrasonic transducer element. 21. The method of claim 13 , further comprising performing at least a portion of an image reconstruction process based, at least in part, on the compressed signal. 22. The method of claim 21 , wherein performing at least a portion of an image reconstruction process comprises performing beamforming. 23. The method of claim 22 , wherein performing beamforming comprises using an integrated backprojection technique, in which at least one of receiver time-of-flight values and receive apodization values are reused within consecutive scans. 24. The method of claim 13 , further comprising selectively storing the digital signal in a memory integrated on the semiconductor die, prior to compressing the digital signal being compressed by the compression circuit.

Assignees

Inventors

Classifications

  • Data rate converters · CPC title

  • with integration of processing functions inside probe or scanhead · CPC title

  • A61B8/488Primary

    involving Doppler signals · CPC title

  • using a transducer array · CPC title

  • involving processing of raw data to produce diagnostic data, e.g. for generating an image · CPC title

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What does patent US9592032B2 cover?
To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the fu…
Who is the assignee on this patent?
Butterfly Network Inc
What technology area does this patent fall under?
Primary CPC classification A61B8/488. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).