Module board

Patent metadata

Field	Value
Publication number	US-9591747-B2
Application number	US-201414201150-A
Country	US
Kind code	B2
Filing date	Mar 7, 2014
Priority date	Sep 9, 2011
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components 4 and 4 h are mounted on one face of a substrate 5 and the multiple electronic components 4 and 4 h are sealed with insulating resin 3 . Multiple columnar connection terminals 2 and 7 are arranged on a peripheral area of the substrate 5 and in one or more small areas 8 on the substrate 5 , respectively. The one or more small areas 8 are set at positions on the substrate 5 , which is not on the peripheral area of the substrate 5 and on which the multiple electronic components 4 and 4 h are not mounted.

First claim

The invention claimed is:

1. A module board comprising a substrate, a plurality of electronic components mounted on one face of the substrate, and an insulating resin sealing the plurality of electronic components,
wherein a plurality of columnar connection terminals are arranged on a peripheral area of the substrate and in one or more predetermined areas on the substrate, and
wherein the one or more predetermined areas are areas of the substrate other than the peripheral area of the substrate where none of the plurality of electronic components are mounted.

2. The module board according to claim 1 ,
wherein the predetermined areas are set between the plurality of electronic components.

3. The module board according to claim 1 ,
wherein the plurality of electronic components include a lower electronic component and a higher electronic component in heights, and a distance between the lower electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the lower electronic component is less than a distance between the higher electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the higher electronic component.

4. The module board according to claim 1 ,
wherein the predetermined areas are set at a position farthest from the columnar connection terminals arranged on the peripheral area of the substrate.

5. The module board according to claim 4 ,
wherein the substrate has a rectangular shape, and
wherein the predetermined areas are set at a position including an intersection point of diagonal lines of the substrate.

6. The module board according to claim 4 ,
wherein the plurality of columnar connection terminals are arranged in a cross pattern in the predetermined areas.

7. The module board according to claim 1 ,
wherein the plurality of columnar connection terminals are connected to a ground electrode.

8. The module board according to claim 1 ,
wherein the plurality of electronic components include heat-variable electronic components, and the predetermined areas are set at a position adjacent to the heat-variable electronic components.

9. The module board according to claim 1 ,
wherein the insulating resin has a flat top face.

10. The module board according to claim 1 ,
wherein the plurality of electronic components are mounted on other face of the substrate.

11. The module board according to claim 2 ,
wherein the plurality of electronic components include a lower electronic component and a higher electronic component in heights, and a distance between the lower electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the lower electronic component is less than a distance between the higher electronic component and a columnar connection terminal arranged in the predetermined areas and most adjacent to the higher electronic component.

12. The module board according to claim 5 ,
wherein the plurality of columnar connection terminals are arranged in a cross pattern in the predetermined areas.

Assignees

• Murata Manufacturing Co

Inventors

• Mizushiro Masaaki

Classifications

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07236

  Soldering or alloying · CPC title