Display device, and method and apparatus for mounting driver IC

Patent metadata

Field	Value
Publication number	US-9591744-B2
Application number	US-201213711967-A
Country	US
Kind code	B2
Filing date	Dec 12, 2012
Priority date	Aug 6, 2012
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

First claim

What is claimed is:

1. A driver integrated chip (IC) mounting apparatus, comprising:
a first stage to support a display panel;
a second stage to support the display panel, the second stage being movable to adjust a distance in a horizontal direction between the first stage and the second stage; and
a jig spaced apart from the second stage in a vertical direction by a predetermined interval, the jig to apply pressure to a driver IC in the vertical direction to be mounted on the display panel, wherein
the display panel is to be supported on top surfaces of the first and second stages.

2. The driver IC mounting apparatus of claim 1 , further comprising a buffering member on the jig.

3. The driver IC mounting apparatus of claim 1 , wherein the second stage includes a protruding portion protruding toward the display panel, the driver IC being mounted on a portion of the display panel overlapping the protruding portion of the second stage.

4. The driver IC mounting apparatus of claim 1 , wherein an outermost edge of the second stage is aligned with an inner side of an outermost bumper unit of the driver IC.

5. A driver integrated chip (IC) mounting method, comprising:
providing a display panel on top surfaces of first and second stages;
moving the second stage to adjust a distance in a horizontal direction between the first and second stages;
mounting a driver IC on the display panel; and
applying pressure to the driver IC in a vertical direction by using a jig spaced apart from the second stage in the vertical direction by a predetermined interval.

6. The method of claim 5 , wherein:
mounting of the driver IC is preformed before moving the second stage, and
moving the second stage includes aligning an outer edge of the second stage with an inner side of an outermost bumper unit of the driver IC in a lengthwise direction of the driver IC.

7. The method of claim 5 , wherein forming the display panel includes:
forming a thin film transistor on a lower substrate;
forming a color filter on an upper substrate;
adhering the upper substrate to a part of the lower substrate, such that the driver IC and the upper substrates are on different parts of the lower substrate; and
forming a plurality of bumper units at ends of the driver IC.

8. The method of claim 7 , wherein forming the display panel further comprises forming a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit to prevent the driver IC from being deformed.

9. The method of claim 8 , wherein forming the deformation preventing bumper unit includes forming a bumper on the driver IC, and forming a conductive ball on the bumper.

10. The method of claim 5 , wherein applying pressure to the driver IC includes applying pressure using by a jig through a buffering member, the buffering member being positioned between the jig and the driver IC.

11. The method of claim 5 , wherein mounting the driver IC on the display panel includes mounting the driver IC on a portion of the display panel that overlaps a protrusion of the second stage, the protrusion of the second stage protruding from an upper surface of the second stage toward the display panel.

12. The driver IC mounting apparatus of claim 1 , wherein the jig does not overlap the first stage.

13. The driver IC mounting apparatus of claim 1 , wherein the display panel is between the second stage and the jig.

Assignees

• Kim Joon-Sam
• Kim Jong-Hwan
• Yeo Sang Won
• Lim Sang-Urn
• Choi Suk-Ho
• Samsung Display Co Ltd

Inventors

• Kim Joon-Sam
• Kim Jong-Hwan
• Yeo Sang Won
• Lim Sang-Urn
• Choi Suk-Ho

Classifications

• Y10T29/41

  Cross-Sectional Technologies · mapped topic

• H05K3/323

  by applying an anisotropic conductive adhesive layer over an array of pads · CPC title

• G02F1/13454 Primary

  Drivers integrated on the active matrix substrate (G02F1/136277 takes precedence) · CPC title

• H05K13/04

  Mounting of components {, e.g. of leadless components} · CPC title

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title