System and method to remove heat from a power amplifier

Patent metadata

Field	Value
Publication number	US-9590573-B2
Application number	US-201414158553-A
Country	US
Kind code	B2
Filing date	Jan 17, 2014
Priority date	Jan 17, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.

First claim

What is claimed is:

1. A system, comprising:
a solid state power amplifier;
a plurality of microchannels configured to be in thermal communication with the solid state power amplifier;
a condenser coupled to the plurality of microchannels, wherein the condenser is configured to dissipate heat from a thermal fluid circulating in the condenser; and
a radiator including a plurality of radiating panels, wherein each of the plurality of radiating panels is configured to be in thermal communication with the condenser, and wherein the plurality of radiating panels are configured to enable heat to be radiated from a satellite in two different planes.

2. The system of claim 1 , wherein the solid state power amplifier comprises Gallium Nitride.

3. The system of claim 1 , wherein:
the solid state power amplifier is formed on a die; and
the plurality of microchannels extend proximate to one or more heat generating elements on the die.

4. The system of claim 3 , wherein:
the plurality of microchannels is coupled to an evaporator; and
the condenser is embedded in the radiator.

5. The system of claim 3 , wherein the radiator is located on one of a side of the satellite.

6. The system of claim 3 , wherein the plurality of microchannels is coupled to an active pump, the active pump configured to pump the thermal fluid through the plurality of micro channels.

7. The system of claim 3 , wherein the plurality of microchannels is coupled to a microchannel cooling circuit, the microchannel cooling circuit comprises a loop heat pipe, the loop heat pipe configured to passively pump the thermal fluid through the plurality of microchannels.

8. The system of claim 1 , wherein the radiator is constructed of a thermally conductive material, an aluminum alloy, or a carbon fiber composite.

9. A satellite, comprising:
a body;
a solid state power amplifier;
a plurality of microchannels configured to be in thermal communication with the solid state power amplifier;
a condenser coupled to the plurality of microchannels, wherein the condenser is configured to radiate heat from a thermal fluid circulating in the condenser; and
a radiator including a plurality of radiating panels, wherein each of the plurality of radiating panels is configured to be in thermal communication with the condenser, and wherein the plurality of radiating panels are configured to enable heat to be radiated from the satellite in two different planes.

10. The satellite of claim 9 , wherein the solid state power amplifier comprises Gallium Nitride.

11. The satellite of claim 9 , wherein:
the solid state power amplifier is formed on a die; and
the plurality of microchannels extend proximate to one or more heat generating elements on the die.

12. The satellite of claim 11 , wherein:
the plurality of microchannels is coupled to an evaporator; and
the condenser is embedded in the radiator.

13. The satellite of claim 11 , wherein the radiator is located on a side of the satellite.

14. The satellite of claim 11 , wherein the plurality of microchannels is coupled to an active pump, the active pump configured to pump the thermal fluid through the plurality of microchannels.

15. The satellite of claim 11 , wherein the plurality of microchannels is coupled to a microchannel cooling circuit, the microchannel cooling circuit comprising a loop heat pipe, the loop heat pipe configured to passively pump the thermal fluid through the plurality of microchannels.

16. A method to manage heat, comprising:
transferring heat from at least one heat generating element on a solid state power amplifier to a plurality of microchannels in thermal communication with the solid state power amplifier;
transferring heat from the plurality of microchannels to a condenser coupled to the plurality of microchannels, wherein the condenser is in thermal communication with a radiator that includes a plurality of radiating panels, wherein each of the plurality of radiating panels are configured to be in thermal communication with the condenser;
transferring the heat from the condenser to one or more of the plurality of radiating panels; and
radiating the heat directly from one or more of the plurality of radiating panels, wherein the plurality of radiating panels are configured to radiate heat in two different planes.

17. The method of claim 16 , wherein the solid state power amplifier comprises Gallium Nitride.

18. The method of claim 16 , wherein:
the solid state power amplifier is formed on a die; and
the plurality of microchannels extend proximate to one or more heat generating elements on the die.

19. The method of claim 16 , wherein the plurality of microchannels is coupled to a pump, the pump configured to pump a thermal fluid through the plurality of microchannels.

20. The method of claim 16 , wherein the plurality of microchannels is coupled to a microchannel cooling circuit, the microchannel cooling circuit comprises a loop heat pipe, the loop heat pipe configured to pump a thermal fluid through the plurality of microchannels.

Assignees

• Boeing Co

Inventors

• Rust Iii Thomas
• Kim Gregory
• Allison Jonathan M
• Whelan Michael A

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H03F3/21 Primary

  with semiconductor devices only {(H03F3/245 takes precedence)} · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• H03F2200/447

  the amplifier being protected to temperature influence · CPC title

• H01L2924/0002

  Electricity · mapped topic