Modular design of a high power, low passive intermodulation, active universal distributed antenna system interface tray

Patent metadata

Field	Value
Publication number	US-9590318-B2
Application number	US-201414779635-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 25, 2013
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A modular high power, low passive intermodulation, active, universal, distributed antenna system interface tray that includes one or more front-end RF frequency duplexers instead of a high power, low passive intermodulation attenuator to achieve superior FIM performance. A cable switch matrix allows for the use of the system among varying power levels* and accomplishes the above in a modular architecture.

First claim

What is claimed is:

1. A modular high power, low passive intermodulation (PIM), active, universal distributed antenna system (DAS) interface tray for providing an interface between a base telecommunication station (BTS) and the DAS that can attenuate the signal input radio frequency (RF) power level from the BTS to signal output RF power levels that are harmonious with the requirements of a DAS network while inducing very low PIM levels into the attenuated RF signal, the interface tray comprising:
a main chassis;
a plurality of RF modules coupled to the main chassis; and
a Supervisor Control Power Supply Unit (PSU) module coupled to the main chassis, wherein the RF modules comprise a downlink section comprising a cable switch matrix comprising a set of cable jumpers and a series of stepped attenuators, the set of cable jumpers configurable on a front panel to attenuate the downlink transmit signals received from the BTS based on input RF power levels of the downlink transmit signals received from the BTS to reduce PIM levels.

2. The interface tray of claim 1 wherein each of the RF modules further includes a front-end duplexer, and an uplink section.

3. The interface tray of claim 2 wherein, the front-end duplexer is a cavity filter configured to enable low PIM functionality at high power levels required by the DAS network.

4. The interface tray of claim 2 wherein the Supervisor Control/PSU module is configured to provide control functions for the required attenuation of a downlink path, an uplink noise detection and uplink gain.

5. The interface tray of claim 2 wherein each RF module is configured for different frequencies,
wherein a front-end duplexer of each RF module is to provide a common antenna port for downlink transmit signals received from a BTS and uplink receive signals transmitted to the BTS, the front-end duplexer to provide downlink transmit signals received from a BTS to the downlink section;
wherein the downlink section is configured to control an output power level of downlink transmit signals provided via the DAS via a software GUI,
wherein the uplink section to configured receive uplink signals via/from the DAS, provide gain and perform a noise detection function on the received uplink signals, and provide the received uplink signals to the front-end duplexer for transmission to the BTS;
wherein the cable switch matrix allows the attenuation of the downlink transmit signals received from the BTS of each RF module to be individually set, and
wherein the front-end duplexer of each RF module is configured to terminate a portion of the downlink transmit signals received from the BTS in a termination resistor and route the signals to the series of stepped attenuators configured with the cable jumpers.

6. The interlace tray of claim 1 wherein the main chassis is designed in such a way that the spacing of input common antenna connector ports do not interfere with each other as a mating connector cable assembly is installed.

7. The interface tray of claim 6 wherein the main chassis includes s staggered rail input system to prevent the one or more RF modules from being installed therein in an incorrect orientation.

8. The interface tray of claim 6 wherein the main chassis is frequency band/power level/air interface agnostic.

9. A modular interface for a distributed antenna system (DAS), the interface module comprising:
a plurality of radio frequency (RF) modules, each RF module configured for different frequencies, each RF module comprising:
a front-end duplexer to provide a common antenna port for downlink transmit signals received from a base telecommunication station (BTS) and uplink receive signals transmitted to the BTS, the front-end duplexer to provide downlink transmit signals received from a BTS to a downlink section;

a downlink section coupled to the front-end duplexer, the downlink section comprising a cable switch matrix comprising a set of cable jumpers and a series of stepped attenuators, the set of cable jumpers configurable on a front panel of the associated RF module to attenuate the downlink transmit signals received from the BTS based on input RF power levels of the downlink transmit signals received from the BTS to reduce passive intermodulation (PIM) levels, the downlink section configured to control an output power level of downlink transmit signals provided via the DAS via a software GUI; and
an uplink section to receive uplink signals via/from the DAS, provide gain and perform a noise detection function on the received uplink signals, and provide the received uplink signals to the front-end duplexer for transmission to the BTS.

10. The modular interface of claim 9 wherein the cable switch matrix allows the attenuation of the downlink transmit signals received from the BTS of each RF module to be individually set.

11. The modular interface of claim 10 wherein the duplexer is configured to terminate a portion of the downlink transmit signals received from the BTS in a termination resistor and route the signals to the series of stepped attenuators configured with the cable jumpers.

Assignees

• Intel Corp

Inventors

• Famili Nader
• Subedi Purna C
• Buch Yatin
• Cook Jason
• Zhu Changru
• Sideris George
• Balue Robert

Classifications

• H04B1/525

  with means for reducing leakage of transmitter signal into the receiver · CPC title

• H01Q21/0025 Primary

  Modular arrays · CPC title

• H01P1/2138

  using hollow waveguide filters (H01P1/2131 takes precedence) · CPC title

• H05K7/14

  Mounting supporting structure in casing or on frame or rack · CPC title

• H05K5/0021

  Electricity · mapped topic