Semiconductor device including an embedded surface mount device and method of forming the same

Patent metadata

Field	Value
Publication number	US-9589938-B2
Application number	US-201514981171-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Feb 13, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

First claim

What is claimed is:

1. A device comprising:
a polymer layer over a first side of a substrate, at least a portion of the polymer layer being removed over a first portion of the first side of the substrate;
a die bonded to the first side of the substrate by a first connector; and
a surface mount device mounted to the die, the surface mount device being between the die and the first side of the substrate, the first portion of the first side of the substrate being over the surface mount device.

2. The device of claim 1 , wherein an active surface of the die is bonded to the first side of the substrate by the first connector.

3. The device of claim 1 further comprising a recess in the first portion of the first side of the substrate.

4. The device of claim 3 , wherein sidewalls of the recess and sidewalls of the polymer layer are substantially aligned.

5. The device of claim 1 , wherein a sidewall of the surface mount device is separated from a sidewall of the polymer layer by at least 10 μm.

6. The device of claim 1 , wherein the surface mount device mounted to the die by a second set of connectors.

7. The device of claim 6 , wherein a sum of a height of the surface mount device and the second set of connectors as measured from an active surface of the die to a first surface of the surface mount device is greater than a standoff height from the active surface of the die to a first surface of the polymer layer, the first surface of the polymer layer being distal the first side of the substrate.

8. The device of claim 1 further comprising an opening extending through the substrate, the opening being over the surface mount device.

9. A structure comprising:
a die having an active surface bonded to a first side of a substrate by a first set of connectors;
a surface mount device bonded to the active surface of the die by a second set of connectors, the surface mount device being between the die and the substrate; and
a polymer layer on the first side of the substrate, the polymer layer surrounding a first portion of the surface mount device, the first portion of the surface mount device being proximate the first side of the substrate.

10. The structure of claim 9 further comprising:
an underfill material between the die and the first side of the substrate, the underfill material surrounding the surface mount device and the first set of connectors.

11. The structure of claim 9 , wherein sidewalls of the polymer layer are spaced from sidewalls of the first portion of the surface mount device by a first spacing.

12. The structure of claim 9 further comprising an opening extending through the substrate, the opening being over the surface mount device.

13. The structure of claim 9 further comprising a recess in the first side of the substrate over the surface mount device.

14. The structure of claim 13 , wherein sidewalls of the recess and sidewalls of the polymer layer are substantially aligned.

15. The structure of claim 9 , wherein a sum of a height of the surface mount device and the second set of connectors as measured from an active surface of the die to a first surface of the surface mount device is greater than a standoff height from the active surface of the die to a first surface of the polymer layer, the first surface of the polymer layer being distal the first side of the substrate.

16. A method comprising:
bonding an active surface of a die to a first side of a substrate using a first conductive connector, a surface mount device being bonded to the active surface of the die, a polymer layer being over a first side of the substrate, the polymer layer surrounding a first portion of the surface mount device, the first portion of the surface mount device being proximate the first side of the substrate.

17. The method of claim 16 , wherein a sidewall of the surface mount device is separated from a sidewall of the polymer layer by a first spacing.

18. The method of claim 16 further comprising recessing the first portion of the first side of the substrate.

19. The method of claim 18 , wherein the surface mount device partially extends into the recess in the first portion of the first side of the substrate.

20. The method of claim 16 further comprising forming an opening through the substrate, the opening being aligned with the first portion of the first side of the substrate.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Hsien-Wei
• Chen Ying-Ju

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title