Glass substrate transfer system and robot arm thereof

Patent metadata

Field	Value
Publication number	US-9589825-B2
Application number	US-201414396038-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Sep 10, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A glass substrate transfer system and a robot arm thereof are provided. The robot arm includes: a substrate fork, a moving assembly and a vacuum chuck. The substrate fork is for taking a glass substrate. The moving assembly is connected with the substrate fork and for making the substrate fork to be moved in a working space. The vacuum chuck is disposed on the substrate fork and for sucking the glass substrate. The vacuum chuck is formed with a fluid path, and the fluid path is contained with a cooling fluid to dissipate heat of the vacuum chuck. The glass substrate transfer system and its robot arm provided by the present invention cool the vacuum chuck in time and thus can avoid affecting the product quality caused by the vacuum chuck being overheated, and the product yield is improved.

First claim

What is claimed is:

1. A robot arm comprising:
a substrate fork, configured for taking a glass substrate;
a moving assembly, connected with the substrate fork and configured for making the substrate fork to be moved in a working space;
a vacuum chuck, disposed on the substrate fork and configured for sucking the glass substrate, the vacuum chuck is formed with a fluid path, the fluid path is contained with a cooling fluid to dissipate heat of the vacuum chuck; and
a heat-dissipating assembly, disposed at a side of the substrate fork, the moving assembly or the vacuum chuck are configured for being moved to above of the vacuum chuck to dissipate heat of the vacuum chuck when the vacuum chuck is heated and does not suck the glass substrate;
wherein the heat-dissipating assembly comprises a gas nozzle, a pipe and a pump sequentially connected in that order, and the one gas nozzle is configured for being moved to above the middle of the vacuum chuck and then spraying ambient-temperature clean gas or low-temperature clean gas onto the vacuum chuck.

2. The robot arm as claimed in claim 1 , wherein the vacuum chuck has one ring-structure.

3. The robot arm as claimed in claim 1 , wherein the vacuum chuck has concentrically arranged multiple ring-structures.

4. The robot arm as claimed in claim 3 , wherein the fluid path is disposed at the interior of the ring-structures.

5. The robot arm as claimed in claim 3 , wherein the fluid path is disposed between the ring-structures.

6. The robot arm as claimed in claim 1 , wherein there are additional gas nozzles, and the additional gas nozzles are configured for being moved to surround the vacuum chuck and then spraying ambient-temperature clean gas or low-temperature clean gas onto the vacuum chuck.

7. A glass substrate transfer system comprising:
a high-temperature furnace and process machine;
a substrate fork, configured for taking a glass substrate;
a moving assembly, connected with the substrate fork and configured for making the substrate fork to be moved in a working space;
a vacuum chuck, disposed on the substrate fork and configured for sucking the glass substrate, the vacuum chuck is formed with a fluid path, and the fluid path is contained with a cooling fluid to dissipate heat of the vacuum chuck; and
a heat-dissipating assembly, disposed at a side of the high-temperature furnace, the process machine, the substrate fork, the moving assembly or the vacuum chuck are configured for being moved to above of the vacuum chuck to dissipate heat of the vacuum chuck when the vacuum chuck is heated and does not suck the glass substrate;
wherein the heat-dissipating assembly comprises a gas nozzle, a pipe and a pump, the gas nozzle is configured for being moved to above of the middle of the vacuum chuck and spraying ambient-temperature clean gas or low-temperature clean gas onto the vacuum chuck.

8. The glass substrate transfer system as claimed in claim 7 , wherein the vacuum chuck has one ring-structure.

9. The glass substrate transfer system as claimed in claim 7 , wherein the vacuum chuck has concentrically arranged multiple ring-structures.

10. The glass substrate transfer system as claimed in claim 9 , wherein the fluid path is disposed at the interior of the ring-structures.

11. The glass substrate transfer system as claimed in claim 9 , wherein the fluid path is disposed between the ring-structures.

12. The glass substrate transfer system as claimed in claim 7 , wherein there are additional gas nozzles, and the additional gas nozzles are configured for being moved to surround the vacuum chuck and then spraying ambient-temperature clean gas or low-temperature clean gas onto the vacuum chuck.

Assignees

• Shenzhen China Star Optoelect
• Shenzhen China Star Optoelect

Inventors

• Sun Shih Ying

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• F27D2003/0046

  comprising one or more movable arms, e.g. forks · CPC title

• F27D2003/0001

  Positioning the charge · CPC title

• Y02P40/57

  Improving the yield, e-g- reduction of reject rates · CPC title