Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

Patent metadata

Field	Value
Publication number	US-9589696-B2
Application number	US-201213667146-A
Country	US
Kind code	B2
Filing date	Nov 2, 2012
Priority date	Nov 4, 2011
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.

First claim

What is claimed is:

1. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having:
a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40,
wherein the polymer binder system includes an acrylic acid ester copolymer, and the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate, and
wherein the anisotropic conductive adhesive film has:
a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less, and
a minimum modulus before curing of 1×10 4 gf/cm 2 or more.

2. The display device as claimed in claim 1 , wherein a total amount of the bisphenol fluorene diacrylate and the isocyanuric acid ethylene oxide modified diacrylate is about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.

3. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition comprising:
an acrylic acid ester copolymer;
at least one selected from the group of a styrene-acrylonitrile resin, an acrylonitrile butadiene rubber, a urethane acrylate resin, an ester urethane resin, and a urethane resin other than the urethane acrylate resin and the ester urethane resin;
an isocyanuric acid ethylene oxide modified diacrylate; and
a bisphenol fluorene diacrylate,
the anisotropic conductive adhesive film having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.

4. The display device as claimed in claim 3 , wherein the styrene-acrylonitrile resin, the acrylonitrile butadiene rubber, the urethane acrylate resin, the ester urethane resin and the urethane resin other than the urethane acrylate resin and the ester urethane resin have a glass transition temperature (Tg) of about 100° C. or higher.

5. The display device as claimed in claim 3 , wherein a total amount of the bisphenol fluorene diacrylate and the isocyanuric acid ethylene oxide modified diacrylate is about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.

6. The display device as claimed in claim 3 , wherein the anisotropic conductive adhesive composition further comprises a (meth)acrylate group containing compound, an organic peroxide, and conductive particles.

7. The display device as claimed in claim 6 , wherein the anisotropic conductive adhesive composition comprises:
about 20 to about 40 wt % of the acrylic acid ester copolymer;
about 1 to about 20 wt % of the at least one selected from the group of the styrene-acrylonitrile resin, the acrylonitrile butadiene rubber, the urethane acrylate resin, the ester urethane resin and the urethane resin other than the urethane acrylate resin and the ester urethane resin;
about 5 to about 25 wt % of the isocyanuric acid ethylene oxide modified diacrylate;
about 5 to about 25 wt % of the bisphenol fluorene diacrylate;
about 1 to about 5 wt % of the (meth)acrylate group containing compound;
about 1 to about 10 wt % of the organic peroxide; and
about 1 to about 10 wt % of the conductive particles, based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.

8. A display device, comprising:
an anisotropic conductive adhesive film having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40; and
an electrode having a height of about 25 μm or more bonded by the anisotropic conductive adhesive film,
wherein the polymer binder system includes an acrylic acid ester copolymer, and the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate, and
wherein the anisotropic conductive adhesive film has a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.

9. The display device as claimed in claim 8 , wherein the anisotropic conductive adhesive film has a connection time of about 5 seconds or less at about 160 to about 200° C.

10. The display device as claimed in claim 8 , wherein the anisotropic conductive adhesive film has a bubble area of about 5% or less based on a total area of the anisotropic conductive adhesive film.

11. The display device as claimed in claim 8 , wherein the display device comprises a film on glass form, and the anisotropic conductive adhesive film is bonded to the glass.

12. A display device bonded by an anisotropic conductive adhesive film, the anisotropic conductive adhesive film having an adhesive strength decreasing rate calculated by Equation 1 of greater than 0 and about 40% or less, a connection resistance increasing rate calculated by Equation 2 of greater than 0 and about 20% or less, and having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more:
Adhesive strength decreasing rate (%)=|( A−B )/ A|× 100  Equation 1:

Connection resistance increasing rate (%)=|( C−D )/ C|× 100,  Equation 2:

where, in Equation 1, A is an adhesive strength after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, B is an adhesive strength after the preliminary pressing, the final pressing, and then reliability testing at 85° C. and 85% RH for 250 hours, and
in Equation 2, C is a connection resistance after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and D is a connection resistance after the preliminary pressing, the final pressing, and then reliability testing at 85° C. and 85% RH for 250 hours,
wherein:
the anisotropic conductive adhesive film includes a polymer binder system and a curing system,
the polymer binder system includes an acrylic acid ester copolymer, and
the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate.

13. The display device as claimed in claim 12 , wherein the anisotropic conductive adhesive film has an adhesive strength of about 700 gf/cm or more after the reliability testing and a connection resistance of about 2.5Ω or less after the reliability testing.

14. The display device as claimed in claim 12 , wherein the anisotropic conductive adhesive film has a minimum modulus when cured of about 1×10 6 gf/cm 2 or more while elevating a temperature at 10° C./min from 30 to 250° C.

15. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a total amount of a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate of about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content, the anisotropic conductive adhesive film having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.

16. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive

Assignees

• Namkung Hyun Hee
• Han Jae Sun
• Kim Hyun Wook
• Seo Jin Young
• Jung Kwang Jin
• Uh Dong Seon
• Cheil Ind Inc

Inventors

• Namkung Hyun Hee
• Han Jae Sun
• Kim Hyun Wook
• Seo Jin Young
• Jung Kwang Jin
• Uh Dong Seon

Classifications

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• C09J133/068

  containing glycidyl groups · CPC title