Pressure sensor and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9588000-B2
Application number	US-201314436957-A
Country	US
Kind code	B2
Filing date	Dec 12, 2013
Priority date	Dec 18, 2012
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A pressure introduction hole of a case has a first introduction hole extended in a predetermined direction to define a first end opening and a second introduction hole extended in a direction different from the predetermined direction to define a second end opening opposite from the first end opening. The second introduction hole is communicated to the first introduction hole. An angle defined between a wall surface of the first introduction hole and located adjacent to the second end opening and a wall surface of the second introduction hole and connected to the wall surface of the first introduction hole is larger than or equal to 90°. The second introduction hole has a communication part communicating with the first introduction hole, and a space increasing chamber further extending from the communication part away from the second end opening.

First claim

The invention claimed is:

1. A pressure sensor comprising:
a case; and
a sensor chip that outputs a sensor signal corresponding to a measurement medium, wherein the case has a pressure introduction hole passing through the case to introduce the measurement medium, and the sensor chip is arranged to close a first end opening of the pressure introduction hole,
the pressure introduction hole has
a first introduction hole extended in a predetermined direction to define the first end opening, and
a second introduction hole extended in a direction different from the predetermined direction to define a second end opening located opposite from the first end opening, the second introduction hole being communicated to the first introduction hole,

an angle defined between a wall surface of the first introduction hole and located adjacent to the second end opening and a wall surface of the second introduction hole and connected to the wall surface of the first introduction hole is larger than or equal to 90°,
the second introduction hole has
a communication part communicating with the first introduction hole between the second end opening and an end portion opposite from the second end opening, and
a space increasing chamber further extending from the communication part away from the second end opening,

an axis passing through a center of the first introduction hole and extending in an extending direction of the first introduction hole and an axis passing through a center of the second introduction hole and extending in an extending direction of the second introduction hole do not cross with each other, and
a wall surface of the first introduction hole located opposite from the second introduction hole, at a portion opposite from the first end opening, has an inclination part that is inclined toward the second introduction hole.

2. The pressure sensor according to claim 1 , wherein
the space increasing chamber of the second introduction hole has a corner part opposite from the communication part and the corner part is rounded.

3. The pressure sensor according to claim 1 , wherein
the first introduction hole is inclined toward the second end opening as extending from the first end opening to the communication part of the second introduction hole.

4. The pressure sensor according to claim 1 , wherein
the case has two of the pressure introduction holes, and
measurement mediums respectively introduced into the two of the pressure introduction holes are different from each other.

5. A method of manufacturing the pressure sensor according to claim 1 , wherein
preparing a mold having an upper die and a lower die combined to define a cavity inside, a first slide die capable to slide inside of the cavity to form the first introduction hole, and a second slide die capable to slide inside of the cavity to form the second introduction hole;
tightly contacting a tip end of the first slide die projected in the cavity onto the second slide die between a tip end of the second slide die projected in the cavity and a portion of the second slide die opposite from the tip end of the second slide die;
forming the case by injecting resin into the cavity to form the first introduction hole by the first slide die and to form the second introduction hole by the second slide die; and
mounting the sensor chip to the case to close the first end opening of the pressure introduction hole.

6. The method of manufacturing the pressure sensor according to claim 5 , wherein
in the preparing of the mold, the second slide die has a recess portion at the tip end projected in the cavity, and
in the tightly contacting, the tip end of the first slide die projected in the cavity is made in tightly contact with a bottom surface and a side surface of the recess portion.

Assignees

• Denso Corp

Inventors

• Itou Masamichi

Classifications

• B29C45/33

  having transversely, e.g. radially, movable mould parts · CPC title

• Y10T29/49002

  Electrical device making · CPC title

• B29L2031/712

  Containers; Packaging elements or accessories, Packages (closures therefor B29L2031/56; ink or toner cartridges B29L2031/7678; squeeze tubes B29L2023/20; suitcases B29L2031/7418) · CPC title

• G01L9/0051 Primary

  using variations in ohmic resistance · CPC title

• G01L19/0654

  against moisture or humidity · CPC title