Method for producing a directional layer by cathode sputtering, and device for implementing the method

Patent metadata

Field	Value
Publication number	US-9587306-B2
Application number	US-96830008-A
Country	US
Kind code	B2
Filing date	Jan 2, 2008
Priority date	Jan 2, 2007
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface ( 4 ), the coating process takes place in a manner whereby particles emanating from a target surface ( 6 ) impinge predominantly from directions whose projections onto the substrate surface ( 4 ) lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator ( 8 ), encompassing plates ( 9 ) that extend at a normal angle to the substrate surface ( 4 ) parallel to the nominal direction in front of the substrate surface ( 4 ), but in lieu of or in addition to such positioning the location or movement of the substrate surface ( 4 ) relative to the target surface ( 6 ) can also be suitably adjusted or controlled.

First claim

What is claimed is:

1. A device for producing a directional layer on a plane substrate surface of a substrate with a constant nominal directionality in the plane substrate surface by means of cathode sputtering, with a vacuum chamber where at least one target is placed and which contains at least one holder suitable for attaching the substrate in such fashion that the plane substrate surface faces a surface of the at least one target, and at least one collimator placed between the target surface and the holder, the collimator consisting essentially of plane plates which are parallel to one another and aligned in a direction normal to the plane substrate surface, where an average length of the plates in the direction normal to the plane substrate surface decreases from a center of the collimator toward outer ends thereof, where a location of the collimator relative to a location of the holder can be switched between two positions such that, in one of the positions, each of the plates occupies a point that is vacant in an other one of the positions, an orientation of the plates being equivalent in both of the positions, and where, in the one of the positions of the collimator, each of the plates, with an exception of one of two end plates, occupies a location approximately situated in a middle between two points that, in the other one of the positions, are occupied by the plates.

2. The device of claim 1 , where the collimator can be moved into the other one of the positions by half a rotation relative to the planar substrate surface about an axis directed toward the planar substrate surface.

3. The device of claim 1 , where the holder can be moved relative to the target surface parallel to the plates.

4. A method for applying, on a plane substrate surface, a magnetic layer with a constant preferred direction of magnetization parallel to the plane substrate surface, comprising:
placing at least one target in a vacuum chamber of a sputtering device;
attaching the substrate to at least one holder suitable for the substrate;
positioning a collimator consisting essentially of plane plates which are parallel to one another and aligned in a direction normal to the plane substrate surface between the target surface and the holder in such fashion that the plane substrate surface faces a surface of the at least one target and at least one collimator placed between the target surface and the holder; an average length of the plates in a direction normal to the plane substrate surface decreases from a center of the collimator toward outer ends thereof; and a thickness of at least part of the plates changes in a horizontal direction that is parallel to the substrate surface so that the thickness decreases from a center point of the at least part of the plates toward outer edge of the collimator;
collimating one or more particles from the at least one target using the collimator; and
producing a directional layer of a substrate with a constant nominal directionality.

5. The method of claim 4 , where the directional layer is the magnetic layer having the preferred direction of magnetization that corresponds to the nominal direction.

6. The method of claim 4 , where the directional layer is a support layer on which the magnetic layer is subsequently applied, the magnetic layer having a preferred direction of magnetization determined by a nominal direction of the support layer.

7. The method according to claim 4 , wherein the preferred direction of magnetization is determined by the nominal directionality and a magnetic material employed in the sputtering.

8. A device for producing a directional layer on a plane substrate surface of a substrate with a constant nominal directionality in the plane substrate surface by means of cathode sputtering, with a vacuum chamber where at least one target is placed and which contains at least one holder suitable for attaching the substrate in such fashion that the plane substrate surface faces a target surface of the at least one target and where at least one collimator is placed between the target surface and the holder, the collimator consisting essentially of plane plates which are parallel to one another and aligned in a direction normal to the plane substrate surface and an average length of the plates decreasing from the center of the collimator toward outer ends thereof, and wherein the collimator can be switched between two positions relative to the holder, with an orientation of the plates equivalent in both of the positions, and wherein in the one of the positions of the collimator each of the plates, with an exception of one of two end plates, occupies a location approximately situated in a middle between two points that, in the other one of the positions, are occupied by the plates.

9. The device of claim 8 , wherein for at least part of the plates a thickness changes parallel to the substrate surface in that said thickness decreases from a center point of each plate toward outer edges.

10. The device of claim 8 , wherein each of the plates of the collimator occupies in each of the two positions a point that is vacant in the other one of the two positions.

11. The device of claim 1 , wherein for at least part of the plates a thickness changes parallel to the substrate surface in that said thickness decreases from a center point of each plate toward outer edges.

12. The method of claim 4 , wherein the collimator is made of aluminum.

13. A method for applying, on a plane substrate surface, a magnetic layer with a constant preferred direction of magnetization parallel to the plane substrate surface, comprising:
placing at least one target in a vacuum chamber of a sputtering device;
attaching the substrate to at least one holder suitable for the substrate;
positioning a collimator consisting essentially of plane plates which are parallel to one another and aligned in a direction normal to the plane substrate surface between the target surface and the holder in such fashion that the plane substrate surface faces a surface of the at least one target and at least one collimator placed between the target surface and the holder; an average length of the plates in a direction normal to the plane substrate surface decreases from a center of the collimator toward outer ends thereof; and a thickness of at least part of the plates changes in a horizontal direction that is parallel to the substrate surface;
collimating one or more particles from the at least one target using the collimator; and
producing a directional layer of a substrate with a constant nominal directionality.

14. A device for producing a directional layer on a plane substrate surface of a substrate with a constant nominal directionality in the plane substrate surface by means of cathode sputtering, comprising:
a vacuum chamber,
at least one target placed in the vacuum chamber,
at least one holder for attaching the substrate to the at least one holder, and
at least one collimator placed between the target surface and the holder, the collimator consisting essentially of plane plates which are parallel to one another and aligned in a direction normal to the plane substrate surface,
wherein the plane substrate surface faces a surface of the at least one target,
wherein an average length of the plane plates in the direction normal to the plane substrate surface decreases from a center of the collimator toward outer ends thereof, and
wherein a thickness of at least part of the plane plates changes in a horizontal direction that is parallel to the substrate surface.

15. The device of claim 14 , wherein for at least part of the plane plat

Assignees

• Rohrmann Hartmut
• Friedli Hanspeter
• Weichart Jürgen
• Kadlec Stanislav
• Dubs Martin
• Evatec Ag

Inventors

• Rohrmann Hartmut
• Friedli Hanspeter
• Weichart Jürgen
• Kadlec Stanislav
• Dubs Martin

Classifications

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• H01J37/34

  operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) · CPC title

• G11B5/851

  Coating a support with a magnetic layer by sputtering · CPC title

• C23C14/34 Primary

  Sputtering · CPC title

• H10P72/0468

  comprising a chamber adapted to a particular process · CPC title