Apparatus and techniques for electronic device encapsulation
US-9343678-B2 · May 17, 2016 · US
US9586226B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9586226-B2 |
| Application number | US-201514697370-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 27, 2015 |
| Priority date | Apr 30, 2014 |
| Publication date | Mar 7, 2017 |
| Grant date | Mar 7, 2017 |
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A coating can be provided on a substrate. Fabrication of the coating can include forming a solid layer in a specified region of the substrate while supporting the substrate in a coating system using a gas cushion. For example, a liquid coating can be printed over the specified region while the substrate is supported by the gas cushion. The substrate can be held for a specified duration after the printing the patterned liquid. The substrate can be conveyed to a treatment zone while supported using the gas cushion. The liquid coating can be treated to provide the solid layer including continuing to support the substrate using the gas cushion.
Opening claim text (preview).
What is claimed is: 1. A coating system for providing a solid layer on a substrate, the system comprising: a platform configured to support the substrate using a gas cushion to float the substrate and configured to convey the substrate along the platform; a printing system configured to deposit a liquid coating in a specified region on a first side of the substrate when the substrate is located in a printing zone of the platform and while the substrate is supported by the gas cushion on a second side opposite the first side; a treatment system configured to treat the deposited liquid to provide a solid layer upon the substrate in the specified region when the substrate is located in a treatment zone of the platform and while the substrate is supported by the gas cushion; wherein the platform is configured to support the substrate continuously during a printing operation in the printing zone and during a treatment operation in the treatment zone. 2. The coating system of claim 1 , wherein the solid layer comprises at least a portion of an encapsulation structure; and wherein the substrate comprises electronic devices, the encapsulation structure established to encapsulate at least a portion of the electronic devices on the substrate. 3. The coating system of claim 1 , wherein the treatment system includes a source of light, the source configured to irradiate the liquid coating to provide the solid layer. 4. The coating system of claim 3 , wherein the source comprises an ultraviolet (UV) source. 5. The coating system of claim 3 , wherein the source comprises an infra-red source. 6. The coating system of claim 1 , wherein the treatment system is configured to one or more of bake or dry the liquid coating to provide the solid layer. 7. The coating system of claim 6 , wherein the treatment system is configured to solidify the liquid coating through one or more of inducing a chemical reaction or removing a carrier fluid included in the liquid coating. 8. The coating system of claim 1 , wherein the platform is configured to hold the substrate for a specified duration after the printing operation and before the treatment operation including continuing to support the substrate using the gas cushion. 9. The coating system of claim 8 , wherein the platform includes a holding zone separate from the printing zone and the treatment zone, the holding zone configured to hold the substrate for the specified duration including continuing to support the substrate using the gas cushion. 10. The coating system of claim 1 , comprising an enclosure housing the printing system, the treatment system, and the platform including a controlled processing environment at or near atmospheric pressure and established to remain below specified limits of particulate contamination level, water vapor content, oxygen content, and ozone content. 11. The coating system of claim 1 , wherein the specified region on the first side of the substrate overlaps with an active region of the substrate comprising an electronic device, and wherein platform is configured to provide the gas to the second side of the substrate opposite the active region. 12. The coating system of claim 1 , wherein the platform is configured to convey the substrate including engaging or gripping the substrate using physical contact with the substrate. 13. The coating system of claim 1 , wherein the gas cushion is established by forcing gas through a porous ceramic material.
with angular orientation of the workpieces · CPC title
Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title
Horizontal transfer of a single workpiece · CPC title
Production flow monitoring, e.g. for increasing throughput · CPC title
Position monitoring, e.g. misposition detection or presence detection · CPC title
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