Component support for dense circuit board

Patent metadata

Field	Value
Publication number	US-9585255-B2
Application number	US-201514644721-A
Country	US
Kind code	B2
Filing date	Mar 11, 2015
Priority date	Mar 11, 2015
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A support apparatus for a component is provided and includes a periphery entirely disposable within a footprint of the component on a surface of a substrate, a first portion having a first surface adhesively connectable to the component, a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining an aperture through which leads are extendable from the component and through the substrate, and vents extending between the discrete sectors from the aperture to the periphery, and bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

First claim

What is claimed is:

1. A support apparatus for a component, the support apparatus comprising:
a periphery entirely disposable within a footprint of the component on a surface of a substrate;
a first portion having a first surface adhesively connectable to the component;
a second portion having a second surface disposable to contact the surface of the substrate in discrete sectors and defining:
an aperture through which leads are extendable from the component and through the substrate, and
vents extending between the discrete sectors from the aperture to the periphery; and
bosses disposed to protrude from the second surface and into through-holes defined in the substrate.

2. The support apparatus according to claim 1 , wherein the first and second surfaces face in opposite directions.

3. The support apparatus according to claim 1 , wherein the discrete sectors are provided as six uniform discrete sectors.

4. The support apparatus according to claim 3 , wherein the aperture has a substantially circular shape.

5. The support apparatus according to claim 3 , wherein the vents are provided as six uniform vents extending radially outwardly between the six uniform discrete sectors.

6. The support apparatus according to claim 5 , wherein the second portion comprises at the vents:
third surfaces parallel to and recessed from a plane of the second surface; and
fourth surfaces oriented transversely with respect to the first, second and third surfaces.

7. The support apparatus according to claim 1 , wherein the bosses are provided as three bosses arrayed around the aperture.

8. The support apparatus according to claim 1 , wherein the bosses comprise interior threading.

9. A circuit board assembly, comprising:
a substrate having first and second opposite substrate surfaces in which a circuit is disposed;
a component, which is electrically connectable to the circuit; and
a support apparatus configured to support the component on the substrate and comprising:
a periphery entirely disposable within a footprint of the component on the first substrate surface;
a first portion having a first support surface adhesively connectable to the component;
a second portion having a second support surface disposable to contact the first substrate surface in discrete sectors and defining:
an aperture through which leads are extendable from the component and through the substrate, and
vents extending between the discrete sectors from the aperture to the periphery;
bosses disposed to protrude from the second support surface and into through-holes defined in the substrate; and
fastening elements disposable to fasten the bosses to the substrate at the through-holes.

10. The circuit board assembly according to claim 9 , wherein the support apparatus comprises metallic material.

11. The circuit board assembly according to claim 9 , wherein the component comprises a capacitor having a substantially cylindrical shape and the periphery has a substantially circular shape.

12. The circuit board assembly according to claim 9 , further comprising adhesive interposed between the periphery and the component.

13. The circuit board assembly according to claim 9 , wherein the first and second support surfaces face in opposite directions.

14. The circuit board assembly according to claim 9 , wherein the substrate defines lead holes through which the leads extend, the lead holes being fluidly communicative with the aperture and the vents.

15. The circuit board assembly according to claim 9 , wherein the bosses extend at least partially through the through-holes.

16. The circuit board assembly according to claim 9 , wherein the bosses are threadably engageable with the fastening elements.

17. The circuit board assembly according to claim 9 , wherein the fastening elements comprise screw-washer combinations.

18. A circuit board assembly, comprising:
a substrate having first and second opposite substrate surfaces in which a circuit is disposed;
an array of components, each of which is electrically connectable to the circuit via component leads; and
an array of support apparatuses respectively supporting corresponding ones of the components on the substrate,
each support apparatus being encompassed within a footprint of the component, adhered to the component, coupled to the substrate in multiple locations and configured to permit fluid flow about the component leads.

19. The circuit board assembly according to claim 18 , wherein at least one or more of the components comprises a capacitor.

20. The circuit board assembly according to claim 18 , wherein the arrays are densely packed.

Assignees

• Raytheon Co

Inventors

• Mercier Dennis W
• Delisle Corey R
• Lott Patrick J
• Zarkh Dimitry

Classifications

• H05K2201/10015

  Non-printed capacitor · CPC title

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H05K3/306 Primary

  with lead-in-hole components (H05K3/32 takes precedence) · CPC title

• H05K3/3447

  Lead-in-hole components · CPC title

• H01G9/26

  Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other · CPC title