System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille

Patent metadata

Field	Value
Publication number	US-9584889-B2
Application number	US-201314011566-A
Country	US
Kind code	B2
Filing date	Aug 27, 2013
Priority date	Aug 27, 2013
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may include a diaphragm for sound transduction. The sound transducer component may further include a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.

First claim

What is claimed is:

1. A packaged MEMS device comprising:
an embedding arrangement comprising a mold compound;
a MEMS device embedded in the mold compound of the embedding arrangement, wherein the MEMS device comprises a diaphragm for sound transduction, and wherein the mold compound braces the diaphragm;
a sound port embedded in the mold compound of the embedding arrangement, the sound port acoustically coupled to the MEMS device; and
a grille disposed in the sound port.

2. The packaged MEMS device according to claim 1 , wherein the grille is electrically conductive.

3. The packaged MEMS device according to claim 2 , wherein the grille is configured to function as a backplate of a capacitive transducer in combination with the diaphragm.

4. The packaged MEMS device according to claim 1 , wherein the embedding arrangement comprises a main embedding part and a cover layer at a first surface of the main embedding part, the main embedding part comprising the mold compound, and the MEMS device being embedded in the mold compound of the main embedding part.

5. The packaged MEMS device according to claim 4 , wherein the sound port extends through the cover layer and wherein the grille is within a portion of the sound port that extends through the cover layer.

6. The packaged MEMS device according to claim 4 , wherein the cover layer comprises a redistribution layer.

7. The packaged MEMS device according to claim 6 , wherein the grille is part of the redistribution layer.

8. The packaged MEMS device according to claim 6 , wherein the grille is electrically conductive and the redistribution layer is in electrical contact with the grille.

9. The packaged MEMS device according to claim 6 , wherein the redistribution layer is configured to provide at least one electrical contact for the MEMS device.

10. The packaged MEMS device according to claim 6 , wherein the redistribution layer is configured to provide an electromagnetic interference shielding for at least one of the MEMS device, electrical connections for the MEMS device, and an underlying redistribution layer.

11. The packaged MEMS device according to claim 4 , wherein the MEMS device is recessed with respect to a first main surface and an opposite second main surface of the main embedding part.

12. The packaged MEMS device according to claim 1 , further comprising:
a further device embedded into the embedding arrangement; and
an electrical connection between the MEMS device and the further device.

13. The packaged MEMS device according to claim 1 , further comprising a cavity formed within the mold compound of the embedding arrangement adjacent to the MEMS device at an opposite side of the MEMS device than the sound port.

14. The packaged MEMS device according to claim 13 , wherein a cross section of the cavity is substantially equal to a surface of the MEMS device.

15. The packaged MEMS device according to claim 1 , wherein the MEMS device comprises a substrate-stripped MEMS die.

16. The packaged MEMS device according to claim 1 , wherein the sound port includes an opening.

17. The packaged MEMS device according to claim 1 , wherein the sound port is adjacent the MEMS device.

18. The packaged MEMS device according to claim 1 , wherein the MEMS device comprises a substrate-stripped MEMS part, the substrate-stripped MEMS part comprising the diaphragm and a backplate, wherein the mold compound of the embedding arrangement embraces the diaphragm and the backplate.

19. A packaged MEMS device comprising:
an embedding arrangement comprising a mold compound;
a MEMS device embedded in the mold compound of the embedding arrangement, wherein the MEMS device comprises a diaphragm for sound transduction, and wherein the mold compound braces the diaphragm;
an opening disposed in the embedding arrangement, the opening adjacent to the MEMS device; and
a grille within the opening.

20. A packaged MEMS device comprising:
an embedding arrangement comprising a mold compound;
a MEMS device embedded in the mold compound of the embedding arrangement, wherein the MEMS device comprises a diaphragm for sound transduction, and wherein the mold compound braces the diaphragm;
a sound port embedded in the embedding arrangement, the sound port acoustically coupled to the MEMS device; and
a grille across the sound port.

21. The packaged MEMS device according to claim 20 , wherein the sound port includes an opening, the grille being across the opening.

22. The packaged MEMS device according to claim 20 , wherein the sound port is adjacent to the MEMS device.

23. A sound transducer component comprising:
an embedding material having a mold compound;
a substrate-stripped MEMS die embedded into the mold compound of the embedding material, the substrate-stripped MEMS die comprising a diaphragm for sound transduction, wherein the mold compound braces the diaphragm; and
a sound port within the embedding material in fluidic contact with the diaphragm.

Assignees

• Infineon Technologies Ag

Inventors

• Escher-Poeppel Irmgard
• Fuergut Edward
• Dehe Alfons

Classifications

• H10D48/50

  Devices controlled by mechanical forces, e.g. pressure · CPC title

• H04R2231/003

  Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms · CPC title

• H04R2201/02

  Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups · CPC title

• H04R31/006

  Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title