Methods for bonding a hermetic module to an electrode array

Patent metadata

Field	Value
Publication number	US-9583458-B2
Application number	US-201313836582-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

First claim

What is claimed is:

1. A method for bonding a hermetic module to an electrode array comprising:
providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate;
attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads, each bond-pad being adjacent to the bottom surface of the electrode array and being configured to align with a corresponding pad;
following the step of attaching, drilling a plurality of holes through each of the plurality of pads to its corresponding bond-pad, wherein each of the pads and its corresponding bond-pad are connected in each of the holes;
filling each drilled hole with biocompatible conductive ink;
forming a rivet on the biocompatible conductive ink over each pad; and
overmolding the electrode array with a moisture barrier material.

2. The method of claim 1 , wherein the pads are annular.

3. The method of claim 1 , further comprising attaching the hermetic module to the electrode array with a bio-compatible non-conductive adhesive.

4. The method of claim 1 , further comprising the holes by a laser.

5. The method of claim 1 , wherein the holes are substantially circular and less than 50 microns in diameter.

6. The method of claim 1 , further comprising using an inkjet or aerojet process to fill each hole with the biocompatible conductive ink.

Assignees

• Charles Stark Draper Laboratory Inc

Inventors

• Sriram Tirunelveli
• Smith Brian
• Mclaughlin Bryan
• Lachapelle John

Classifications

• A61B5/0031 Primary

  Implanted circuitry · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title