Method for transferring light-emitting elements onto a package substrate

Patent metadata

Field	Value
Publication number	US-9583450-B2
Application number	US-201514886567-A
Country	US
Kind code	B2
Filing date	Oct 19, 2015
Priority date	Oct 20, 2014
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the supporting substrate and having a surface opposite to the supporting substrate; disposing the light-emitting unit spacingly above a package substrate in such a manner that the surface of each of the light-emitting elements faces the package substrate; and disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity, so as to connect the light-emitting elements with the package substrate in a non-contact transferring method.

First claim

What is claimed is:

1. A method for transferring light-emitting elements onto a package substrate, comprising:
providing a light-emitting unit including a supporting substrate and a plurality of light-emitting elements, each of the light-emitting elements being removably connected to the supporting substrate and having a surface opposite to the supporting substrate;
disposing the light-emitting unit spacingly above a package substrate in such a manner that the surface of each of the light-emitting elements faces the package substrate; and
disconnecting the light-emitting elements from the supporting substrate to allow the light-emitting elements to fall onto the package substrate by gravity,
wherein the package substrate includes a plurality of connecting elements disposed correspondingly in position between the light-emitting elements and the package substrate for electrically interconnecting the light-emitting elements and the package substrate, and
wherein, after said disconnecting, each of the light-emitting elements falls onto and contacts a corresponding one of the connecting elements.

2. The method of claim 1 , wherein the step of disconnecting the light-emitting elements is conducted in a chamber under a pressure that is less than 760 torr.

3. The method of claim 1 , wherein the light-emitting elements at least include a first group of the light-emitting elements and a second group of the light-emitting elements, the second group of the light-emitting elements having a height from the supporting substrate that is different from that of the first group of the light-emitting elements.

4. The method of claim 1 , wherein the package substrate is one of a printed circuit board, a thin film transistor (TFT) substrate, and a complementary metal-oxide-semiconductor (CMOS) substrate.

5. The method of claim 1 , wherein the connecting elements are made of an alloy having a eutectic temperature ranging from 150° C. to 300° C.

6. The method of claim 1 , wherein the supporting substrate is a light release tape, and the step of disconnecting the light-emitting elements from the supporting substrate is conducted by irradiating the supporting substrate with a light having a predetermined wavelength.

7. The method of claim 1 , wherein the light-emitting elements are connected to the supporting substrate through magnetic attraction, and the step of disconnecting the light-emitting elements from the supporting substrate is conducted by diminishing the magnetic attraction.

8. The method of claim 1 , wherein the light-emitting elements are connected to the supporting substrate through a connecting layer.

9. The method of claim 8 , wherein the connecting layer is made of an alloy having a eutectic temperature ranging from 150° C. to 300° C., and the step of disconnecting the light-emitting elements from the supporting substrate is conducted by heating the connecting layer so as to melt the connecting layer.

Assignees

• Playnitride Inc

Inventors

• Li Yu-Chu
• Lai Yu-Hung
• Lin Tzu-Yang

Classifications

• H10P72/7432

  used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title