Installation fixture for elastomer bands

Patent metadata

Field	Value
Publication number	US-9583377-B2
Application number	US-201314109400-A
Country	US
Kind code	B2
Filing date	Dec 17, 2013
Priority date	Dec 17, 2013
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

An installation fixture adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber is disclosed, which includes an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band, and a base plate configured to be attached to the annular ring, the base plate having a plurality of radially extending portions adapted to receive a plurality of mechanical fasteners at locations corresponding to mounting holes in the semiconductor substrate support.

First claim

What is claimed is:

1. An installation fixture adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, the installation fixture comprising:
an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band; and
a base plate configured to be attached to the annular ring, the base plate having a plurality of radially extending portions adapted to receive a plurality of mechanical fasteners at locations corresponding to mounting holes in the semiconductor substrate support, and the base plate including an outer recess on an upper surface of the base plate configured to receive a lower surface of the annular ring.

2. The installation fixture of claim 1 , comprising:
an annular recess on an inner portion of an upper surface of the annular ring.

3. The installation fixture of claim 2 , wherein the annular recess is adapted to be located above an upper surface of the semiconductor substrate support.

4. The installation fixture of claim 1 , wherein the base plate has an inner recess on a lower surface of the base plate, and wherein the inner recess is adapted to be located above an upper surface of the semiconductor substrate support.

5. The installation fixture of claim 1 , wherein the base plate includes a plurality of holes each configured to receive a fastener, which attaches the base plate to the annular ring.

6. The installation fixture of claim 1 , wherein the vertically extending portion has an angled tip at a free end thereof.

7. The installation fixture of claim 1 , wherein the base plate has a generally annular outer diameter.

8. The installation fixture of claim 1 , wherein the annular ring is made of polytetrafluoroethylene (PTFE) and the base plate is made of polyethylene terephthalate (PET).

9. An elastomer band installation kit, the kit comprising:
an installation fixture adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, the installation fixture comprising:
an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band; and
a base plate configured to be attached to the annular ring, the base plate having a plurality of radially extending portions with through-holes adapted to receive a plurality of mechanical fasteners at locations corresponding to mounting holes in the semiconductor substrate support, the base plate including an outer recess on an upper surface of the base plate configured to receive a lower surface of the annular ring; and

a plurality of mechanical fasteners each adapted to fit through the mounting holes of the substrate support and through the through-holes of the installation fixture.

10. The kit of claim 9 , comprising:
an annular recess on an inner portion of an upper surface of the annular ring.

11. The kit of claim 10 , wherein the annular recess is adapted to be located above an upper surface of the semiconductor substrate support.

12. The kit of claim 9 , wherein the base plate has an inner recess on a lower surface of the base plate, and wherein the inner recess is adapted to be located above an upper surface of the semiconductor substrate support.

13. The kit of claim 9 , wherein the base plate includes a plurality of holes each configured to receive a fastener, which attaches the base plate to the annular ring.

14. The kit of claim 9 , wherein the vertically extending portion has an angled tip at a free end thereof.

15. The kit of claim 9 , wherein the base plate has a generally annular outer diameter.

16. The kit of claim 9 , wherein the annular ring is made of polytetrafluoroethylene (PTFE) and the base plate is made of polyethylene terephthalate (PET).

17. The kit of claim 9 , comprising:
a protective cover configured to fit around and over the vertical extending portion and the outer edge of the annular ring.

18. A method of installing an elastomer band as a protective edge seal around a portion of a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber, the method comprising:
disposing an elastomer band around a vertically extending portion of an installation fixture, the installation fixture comprising:
an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band; and
a base plate attached to the annular ring, the base plate having a plurality of radially extending portions and a plurality of mechanical fasteners in mounting holes in the semiconductor substrate support, the base plate including an outer recess on an upper surface of the base plate configured to receive a lower surface of the annular ring; and

sliding the elastomer band off the vertically extending portion of the installation fixture and into a mounting groove in the substrate support adapted to receive the elastomer band.

Assignees

• Lam Res Corp

Inventors

• Chhatre Rish
• Schaefer David

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0441 Primary

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10D84/01 Primary

  Manufacture or treatment · CPC title

• H01L21/68785

  Electricity · mapped topic

• Y10T29/53657

  to apply or remove a resilient article [e.g., tube, sleeve, etc.] · CPC title