Method of forming non-continuous line pattern and non-continuous line pattern structure

Patent metadata

Field	Value
Publication number	US-9583343-B2
Application number	US-201514753019-A
Country	US
Kind code	B2
Filing date	Jun 29, 2015
Priority date	May 20, 2015
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A method of forming a non-continuous line pattern includes forming a DSA material layer on a substrate, performing a phase separation of the DSA material layer to form an ordered periodic pattern including a plurality of first polymer structures and the second polymer structures arranged alternately, forming a first mask to cover a first portion of the ordered periodic pattern, performing a first etching process to remove a portion of the first polymer structures exposed by the first mask, removing the first mask, forming a second mask to cover a second portion of the ordered periodic pattern, with an interval to the first portion of the ordered periodic pattern, performing a second etching process to remove a portion of the second polymer structures exposed by the second mask, and removing the second mask. The remaining first polymer structures and the remaining second polymer structures are not connected to each other.

First claim

What is claimed is:

1. A non-continuous line pattern structure on a semiconductor integrated circuit (IC) substrate, comprising:
a plurality of first line pattern segments parallel to a first direction disposed on the semiconductor IC substrate, any two adjacent first line pattern segments of the first line pattern segments having a first line spacing disposed between the two adjacent first line pattern segments, wherein the first line pattern segments are composed of a plurality of first polymer structures respectively; and
a plurality of second line pattern segments parallel to the first direction disposed on the semiconductor IC substrate, any two adjacent second line pattern segments of the second line pattern segments having a second line spacing disposed between the two adjacent second line pattern segments, wherein the second line pattern segments are composed of a plurality of second polymer structures respectively,

wherein the first polymer structures and the second polymer structures comprise directed self-assembly (DSA) material, the first line pattern segments and the second line pattern segments are arranged alternately along a second direction perpendicular to the first direction, and the first line pattern segments and the second line pattern segments are not overlapped with each other along the second direction and are not connected to each other.

2. The non-continuous line pattern structure on the semiconductor IC substrate according to claim 1 , wherein each of the first line pattern segments has a first end adjacent to the second line pattern segments, each of the second line pattern segments has a second end adjacent to the first line pattern segments, and the first ends and the second ends have an interval along the first direction.

3. The non-continuous line pattern structure on the semiconductor IC substrate according to claim 2 , wherein a width of the interval is about 10 nm to about 100 nm.

4. The non-continuous line pattern structure on the semiconductor IC substrate according to claim 1 , wherein the first spacing is equal to a line width of the second line pattern segments, and the second spacing is equal to a line width of the first line pattern segments.

5. The non-continuous line pattern structure on the semiconductor IC substrate according to claim 4 , wherein the first line pattern segments and the second line pattern segments have the same line widths.

6. The non-continuous line pattern structure on the semiconductor IC substrate according to claim is claim 1 , wherein the DSA material comprises block co-polymer.

7. The non-continuous line pattern structure on the semiconductor IC substrate according to claim 1 , wherein the first polymer structures are hydrophilic, and the second polymer structures are hydrophobic.

Assignees

• United Microelectronics Corp

Inventors

• Chen Yu-Te
• Liou En-Chiuan
• Tseng Chia-Hsun
• Su Shin-Feng
• Hung Yu-Ting
• Tsai Meng-Lin

Classifications

• H10P76/2042

  using lasers · CPC title

• H10P76/408

  characterised by their sizes, orientations, dispositions, behaviours or shapes · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P76/20

  of masks comprising organic materials · CPC title

• H10P50/286

  of organic materials · CPC title