US9583230B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9583230-B2 |
| Application number | US-201314097136-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 4, 2013 |
| Priority date | Sep 30, 2008 |
| Publication date | Feb 28, 2017 |
| Grant date | Feb 28, 2017 |
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The present invention provides an electrically conductive polyethylene resin composition having a stable volume resistance value and in addition, a low-friction property and a wear-resistant property and a resin molding, a sliding bearing, and a sliding sheet made of the electrically conductive polyethylene resin composition. The electrically conductive polyethylene resin composition contains 100 parts by weight of ultra-high-molecular-weight polyethylene resin which cannot be injection-molded and has a weight average molecular weight of one million to four millions, 2 to 15 parts by weight of Ketjenblack, and 0.5 to 5 parts by weight of at least one powder, having an average particle size of 1 to 30 μm, which is selected from among polytetrafluoroethylene resin powder, graphite powder, and silicone resin powder.
Opening claim text (preview).
The invention claimed is: 1. An electrically conductive polyethylene resin molding formed by compression-molding an electrically conductive polyethylene resin composition, wherein said electrically conductive polyethylene resin composition comprises 100 parts by weight of ultra-high-molecular-weight polyethylene resin which cannot be injection-molded, 2 to 15 parts by weight of electrically conductive carbon, and 0.5 to 5 parts by weight of at least one powder selected from among polytetrafluoroethylene resin powder, graphite powder, and silicone resin powder, and particles of said ultra-high molecular weight polyethylene resin which cannot be injection-molded are unspherical, and said electrically conductive carbon and said powders are disposed at grain boundaries of said particles of said ultra-high-molecular-weight polyethylene resin which cannot be injection molded and are unspherical. 2. The electrically conductive polyethylene resin molding according to claim 1 , wherein said ultra-high-molecular-weight polyethylene resin which cannot be injection-molded is ultra-high-molecular-weight polyethylene resin having a weight average molecular weight of one million to four millions. 3. The electrically conductive polyethylene resin molding according to claim 1 , wherein an average particle size of said particles of said ultra-high-molecular-weight polyethylene resin which cannot be injection-molded is not less than three times larger than that of said electrically conductive carbon and that of said powders. 4. The electrically conductive polyethylene resin molding according to claim 1 , wherein said average particle size of said particles of said ultra-high-molecular-weight polyethylene resin which cannot be injection-molded is 100 to 200 μm; said average particle size of said electrically conductive carbon is not more than 1 μm; and said average particle size of said powders is 1 to 30 μm. 5. The electrically conductive polyethylene resin molding according to claim 1 , wherein said electrically conductive carbon is Ketjenblack. 6. The electrically conductive polyethylene resin molding according to claim 1 , wherein said polytetrafluoroethylene resin powder is modified polytetrafluoroethylene resin powder modified with alkyl vinyl ether. 7. The electrically conductive polyethylene resin molding according to claim 1 , wherein said graphite particle is artificial graphite containing not less than 98.5 wt % of fixed carbon. 8. The electrically conductive polyethylene resin molding according to claim 1 , wherein said silicone resin powder is spherical. 9. The electrically conductive polyethylene resin molding according to claim 1 , which has a volume resistance value of 1.0×104 to 1.0×1010 Ωcm.
Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof · CPC title
mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title
having improved processability or containing aids for moulding methods · CPC title
Carbon · CPC title
Manufacture of films or sheets · CPC title
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