Slot die coating apparatus and coating method using the same

US9581872B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9581872-B2
Application numberUS-201514623468-A
CountryUS
Kind codeB2
Filing dateFeb 16, 2015
Priority dateJul 18, 2014
Publication dateFeb 28, 2017
Grant dateFeb 28, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A slot die coater planarizing an upper surface of an encapsulation layer and a coating method using the same. The slot die coater includes a slit nozzle configured to supply a coating solution. The slit nozzle includes a hole vertically penetrating a center portion thereof, a first bottom surface disposed at a movement direction side of the slit nozzle with reference to the hole, and a second bottom surface disposed at an opposite direction side of the movement direction of the slit nozzle with reference to the hole. A width of the first bottom surface is different from the width of the second bottom surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A slot die coater comprising: a slit nozzle configured to supply a coating solution onto a substrate, wherein: the slit nozzle comprises: a hole vertically penetrating a center portion thereof; a first bottom surface positioned at a movement direction side of the slit nozzle with reference to the hole; and a second bottom surface positioned at an opposite direction side of the movement direction of the slit nozzle with reference to the hole; the first bottom surface and the second bottom surface are flat and parallel to an upper surface of the substrate; the width of the first bottom surface is less than the width of the second bottom surface; and both the front side and the rear side of a lower portion of the slit nozzle are tapered toward the first and second bottom surfaces. 2. The slot die coater of claim 1 wherein a distance between the first bottom surface and the substrate is greater than a distance between the second bottom surface and the substrate. 3. The slot die coater of claim 1 , wherein: the first bottom surface has a width of 0.1 mm to 0.9 mm; and the second bottom surface has a width of 0.1 mm to 0.9 mm. 4. A coating method comprising: mounting a substrate on a stage; and moving a slit nozzle over the substrate while supplying a coating solution to the substrate to form a coating layer, wherein the slit nozzle comprises: a hole vertically penetrating a center portion thereof; a first bottom surface disposed at a movement direction side of the slit nozzle with reference to the hole; and a second bottom surface disposed at an opposite direction side of the movement direction of the slit nozzle with reference to the hole; the first bottom surface and the second bottom surface are flat and parallel to an upper surface of the substrate; the width of the first bottom surface is different from the width of the second bottom surface; and during moving of the slit nozzle, a distance between the second bottom surface and the substrate is substantially the same as the thickness of the coating layer. 5. The coating method of claim 4 , wherein, during moving of the slit nozzle, the distance between the first bottom surface and the substrate is greater than the thickness of the coating layer. 6. The coating method of claim 4 , wherein the width of the first bottom surface is less than the width of the second bottom surface. 7. The coating method of claim 6 , wherein a distance between the first bottom surface and the substrate is greater than a distance between the second bottom surface and the substrate.

Assignees

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Classifications

  • Physics · mapped topic

  • Physics · mapped topic

  • Electricity · mapped topic

  • with elements moving in a straight line, e.g. along a track; Mobile sprinklers {(watering arrangements making use of movable installations A01G25/09)} · CPC title

  • Cells with plural compartments or having plurality of liquid crystal microcells partitioned by walls, e.g. one microcell per pixel · CPC title

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What does patent US9581872B2 cover?
A slot die coater planarizing an upper surface of an encapsulation layer and a coating method using the same. The slot die coater includes a slit nozzle configured to supply a coating solution. The slit nozzle includes a hole vertically penetrating a center portion thereof, a first bottom surface disposed at a movement direction side of the slit nozzle with reference to the hole, and a second b…
Who is the assignee on this patent?
Samsung Display Co Ltd, K C Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/1303. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).