Evaporator with phase change material

Patent metadata

Field	Value
Publication number	US-9581369-B2
Application number	US-201414565687-A
Country	US
Kind code	B2
Filing date	Dec 10, 2014
Priority date	Jun 10, 2009
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

An evaporator configured to transfer heat between air flowing through the evaporator and refrigerant within the evaporator, and transfer heat between the refrigerant within the evaporator and phase change material (PCM) within the evaporator. The evaporator includes a first plate, a second plate, and a first tube. The second plate is coupled to the first plate to form an assembly that defines a cavity to contain PCM. The assembly also defines a first opening that cooperates with corresponding first openings in other assemblies to define a first manifold to convey refrigerant. The first manifold is defined when the assembly is arranged with the other assemblies to form a stack. The first tube is in fluidic communication with the first manifold. The assembly cooperates with an adjacent assembly of the other assemblies when the stack is formed to define a first slot configured to receive the first tube.

First claim

The invention claimed is:

1. An evaporator for an air conditioning system, said evaporator configured to transfer heat between air flowing through the evaporator and refrigerant within the evaporator, and transfer heat between the refrigerant within the evaporator and phase change material (PCM) within the evaporator, said evaporator comprising:
a first plate; a second plate coupled to the first plate to form a first assembly that defines a cavity to contain PCM, wherein the first assembly also defines a first opening that cooperates with corresponding first openings in additional assemblies, each of said additional assemblies being formed of a further second plate coupled to a further first plate, to define a first manifold to convey refrigerant, wherein said first manifold is defined when the first assembly is arranged with the other plate assemblies to form a stack; and
a first tube in fluidic communication with the first manifold,
wherein the assembly cooperates with an adjacent assembly of the other assemblies when the stack is formed to define a first slot configured to receive the first tube.

2. The evaporator set forth in claim 1 , wherein the first assembly and the adjacent assembly further cooperate to define a first passage to fluidicly couple the first tube to the first manifold, and thermally couple refrigerant in the first passage to PCM in the cavity.

3. The evaporator set forth in claim 1 , wherein the first plate and the second plate each define a wall section that is in direct contact with PCM on one side of the wall section and in direct contact with refrigerant on the other side of the wall section.

4. The evaporator set forth in claim 1 , wherein the first assembly and the other assemblies cooperate to form a header portion of the evaporator, and the first tube and a plurality of other tubes cooperate to form a body portion of the evaporator.

5. The evaporator set forth in claim 1 , wherein the first plate and the second plate each define a fill opening that cooperates with corresponding fill openings in the other assemblies to define a fill manifold for hydraulic communication of PCM between the cavities of each of the assemblies when the stack is formed.

6. The evaporator set forth in claim 1 , wherein the first assembly is further configured to define a second opening that cooperates with corresponding second openings in the other assemblies to define a second manifold to convey refrigerant, said second manifold defined when the stack is formed, wherein said assembly includes a second tube in fluidic communication with the second manifold, wherein the first assembly and the adjacent assembly further cooperate to define a second slot configured to receive the second tube.

7. The evaporator set forth in claim 6 , wherein the evaporator is configured so the first tube conveys refrigerant away from the first manifold, and the second tube conveys refrigerant toward the second manifold.

8. The evaporator set forth in claim 6 , wherein the first assembly and the adjacent assembly further cooperate to define a first passage to fluidicly couple the first tube to the first manifold and thermally couple refrigerant in the first passage to PCM in the cavity, and a second passage to fluidicly couple the second tube to the second manifold and thermally couple refrigerant in the second passage to PCM in the cavity.

9. The evaporator set forth in claim 6 , wherein the first plate and the second plate each define a fill opening that cooperates with corresponding fill openings in the other assemblies to define a fill manifold for hydraulic communication of PCM between the cavities of each of the first and additional assemblies when the stack is formed.

Assignees

• Mahle Int Gmbh

Inventors

• Vreeland Gary S
• Lipa Scott B

Classifications

• F25B2400/24

  Thermal storage element · CPC title

• F25B39/022

  with plate-like or laminated elements · CPC title

• F28F21/08

  of metal · CPC title

• F28D1/0341

  with U-flow or serpentine-flow inside the conduits · CPC title

• F28D9/005

  the plates having openings therein for both heat-exchange media · CPC title