Electrodes for Metal-Ion Batteries
US-2016308205-A1 · Oct 20, 2016 · US
US9580809B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9580809-B2 |
| Application number | US-201514596338-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2015 |
| Priority date | Jan 16, 2014 |
| Publication date | Feb 28, 2017 |
| Grant date | Feb 28, 2017 |
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An article includes a substrate; and a coating disposed on the substrate that includes a microporous layer; a gradient in a density of a volume of the microporous layer, and a plurality of dendritic veins that are anisotropically disposed in the coating. A process for forming a coating includes disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer, performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium including the activatable etchant; and the etchant oxidizer, forming an etchant product comprising atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating.
Opening claim text (preview).
What is claimed is: 1. A process for forming a coating, the process comprising: disposing an activating catalyst on a substrate; introducing an activatable etchant; introducing an etchant oxidizer; performing an oxidation-reduction reaction between the substrate, the activatable etchant, and the etchant oxidizer in a presence of the activating catalyst, the oxidation-reduction reaction occurring in a liquid medium comprising: the activatable etchant; and the etchant oxidizer; forming an etchant product comprising a plurality of atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a dendritic vein in the substrate to form the coating, the dendritic vein being anisotropically disposed in the coating, wherein the coating comprises a uniform gradient in an index of refraction of the coating that varies from 1 to 3.9. 2. The process of claim 1 , further comprising forming a gradient in a density of a volume of the coating. 3. The process of claim 2 , further comprising controlling a reflectivity of coating. 4. The process of claim 3 , wherein the coating has a reflectivity tuned from 10% to 0.01% at a wavelength from 30 nm to 10 cm. 5. The process of claim 2 , wherein a temperature of the substrate during the oxidation-reduction reaction is less than 150° C. 6. A process for forming a coating, the process comprising: disposing an activating catalyst on a substrate; introducing an activatable etchant; subjecting the activating catalyst and the activatable etchant to an electric potential; performing an electrochemical reaction between the substrate and the activatable etchant in a presence of the activating catalyst and the electric potential, the electrochemical reaction occurring in a liquid medium comprising: the activatable etchant; and an etchant oxidizer; forming an etchant product comprising a plurality of atoms from the substrate; removing a portion of the etchant product from the substrate; and forming a plurality of dendritic veins in the substrate to form the coating, the plurality of dendritic veins being anisotropically disposed in the coating, wherein the coating comprises a uniform gradient in an index of refraction of the coating that varies from 1 to 3.9. 7. The process of claim 6 , wherein a temperature of the substrate during the electrochemical reaction is less than 150° C.
Chemical etching · CPC title
Etching of wafers, substrates or parts of devices · CPC title
of conductive or resistive materials · CPC title
Electricity · mapped topic
Use of metal, e.g. activation, sensitisation with noble metals · CPC title
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