Polyamide ester resin, method for preparing the same, and molded article including the same

US9580552B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9580552-B2
Application numberUS-201514685927-A
CountryUS
Kind codeB2
Filing dateApr 14, 2015
Priority dateSep 23, 2014
Publication dateFeb 28, 2017
Grant dateFeb 28, 2017

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R 1 is a C 3 to C 12 linear, branched or cyclic alkylene group.

First claim

Opening claim text (preview).

What is claimed is: 1. A polyamide ester resin comprising: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more: wherein R 1 is a C 3 to C 12 linear, branched or cyclic alkylene group. 2. The polyamide ester resin according to claim 1 , wherein the repeat unit represented by Formula 1 is derived from a cyclic ester compound represented by the following Formula 2, a hydroxycarboxylic acid compound represented by the following Formula 3, or a mixture thereof: wherein R 1 in Formula 2 and 3 is the same as defined in Formula 1. 3. The polyamide ester resin according to claim 1 , wherein the dicarboxylic acid comprises about 50 mol % to about 100 mol % of a C 8 to C 20 aromatic dicarboxylic acid and optionally about 50 mol % or less of a C 6 to C 20 aliphatic dicarboxylic acid. 4. The polyamide ester resin according to claim 1 , wherein the diamine comprises at least one C 4 to C 20 aliphatic diamine. 5. The polyamide ester resin according to claim 1 , wherein the repeat unit represented by Formula 1 is present in an amount of about 1 part by mole to about 30 parts by mole based on about 100 parts by mole of the repeat unit derived from the dicarboxylic acid and the repeat unit derived from the diamine, and a molar ratio of the repeat unit derived from the dicarboxylic acid to the repeat unit derived from the diamine (dicarboxylic acid/diamine) ranges from about 0.95 to about 1.15. 6. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a crystallization temperature (Tc) of about 250° C. to about 290° C., a glass transition temperature (Tg) of about 80° C. to about 120° C., an intrinsic viscosity of about 0.5 dL/g to about 2.0 dL/g, and a water absorption rate of about 1.5% or less as measured on a specimen having a size of about 100 mm×about 100 mm×about 3 mm after treatment of the specimen at about 50° C. and about 90% RH for about 48 hours. 7. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a color change (ΔE) of about 4 to about 7, as represented by Equation 1: Color change (Δ E )=√{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}  [Equation 1] wherein ΔL* is a difference of L* before and after a scorch test, Δa* is a difference of a* before and after the scorch test, and Δb* is a difference of b* before and after the scorch test. 8. A method for preparing a polyamide ester resin, comprising: polymerizing a monomer mixture comprising a dicarboxylic acid, a diamine, and a cyclic ester compound represented by the following Formula 2 and/or a hydroxycarboxylic acid compound represented by the following Formula 3, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more: wherein R 1 in Formula 2 and 3 is a C 3 to C 12 linear, branched or cyclic alkylene group. 9. The method according to claim 8 , comprising: preparing a prepolymer by polymerization of the monomer mixture; and performing solid-state polymerization of the prepolymer. 10. The method according to claim 9 , wherein the solid-state polymerization is performed by heating the prepolymer to a temperature of about 150° C. to about 280° C. 11. A molded article formed from the polyamide ester resin according to claim 1 .

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Classifications

  • C08G69/44Primary

    Polyester-amides · CPC title

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What does patent US9580552B2 cover?
A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discolor…
Who is the assignee on this patent?
Samsung Sdi Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08G69/44. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).