Automatic generation of reference spectra for optical monitoring of substrates

Patent metadata

Field	Value
Publication number	US-9579767-B2
Application number	US-201113087789-A
Country	US
Kind code	B2
Filing date	Apr 15, 2011
Priority date	Apr 28, 2010
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A computer-implemented method of generating reference spectra includes polishing a first substrate in a polishing apparatus having a rotatable platen, measuring a sequence of spectra from the substrate during polishing with an in-situ monitoring system, associating each spectrum in the sequence of spectra with a index value equal to a number of platen rotations at which the each spectrum was measured, and storing the sequence of spectra as reference spectra.

First claim

What is claimed is:

1. A computer-implemented method of generating reference spectra, comprising:
polishing a first substrate in a polishing apparatus having a rotatable platen;
measuring a first sequence of spectra from the first substrate during polishing with a first in-situ monitoring system;
associating each spectrum in the first sequence of spectra with an index value equal to a number of platen rotations at which the each spectrum was measured;
storing the first sequence of spectra as reference spectra;
receiving data from a second in-situ monitoring system that monitors the first substrate during polishing of the first substrate;
detecting a polishing endpoint of the first substrate during polishing of the first substrate based on the data from the second in-situ monitoring system and without accessing data from the first in-situ monitoring system to detect the polishing endpoint;
determining a target index value based on the number of platen rotations at the time the polishing endpoint is detected by the second in-situ monitoring system;
polishing a second substrate in the polishing apparatus;
measuring a second sequence of spectra from the second substrate during polishing with the first in-situ monitoring system and without the second in-situ monitoring system; and
adjusting a polishing parameter for at least one zone on the second substrate to adjust a polishing rate of the at least one zone based on the reference spectra, the second sequence of spectra, and the target index value.

2. The method of claim 1 , wherein the target index value is the number of platen rotations at the time the second in-situ monitoring system detects the polishing endpoint of the first substrate.

3. The method of claim 1 , wherein determining the target index value comprises combining a plurality of endpoint times, and the target index value is the number of platen rotations at the combined plurality of endpoint times.

4. The method of claim 1 , further comprising performing a post-polish thickness measurement of the first substrate.

5. The method of claim 4 , further comprising determining an initial index value, and adjusting the initial index value based on the post-polish thickness measurement.

6. The method of claim 1 , further comprising:
for each measured spectrum in the second sequence of spectra, determining a best matching reference spectrum from the reference spectra to generate a sequence of best-matching reference spectra;
generating a sequence of index values using index values associated with the best matching reference spectra; and
fitting a linear function to the sequence of index values.

7. The method of claim 6 , wherein the steps of measuring the second sequence of spectra, determining the best matching reference spectrum from the reference spectra, generating the sequence of index values and fitting the linear function to the sequence of index values are performed for each zone of the second substrate.

8. The method of claim 7 , further comprising:
determining a projected time at which at least one zone of the second substrate will reach the target index value based on the linear function; and
wherein the polishing parameter for at least one zone on the second substrate is adjusted such that the at least one zone has closer to the target index at the projected time than without such adjustment.

9. The method of claim 8 , further comprising detecting an endpoint based on a time that the linear function for a reference zone of the at least one zone reaches the target index value.

10. The method of claim 8 , further comprising detecting a polishing endpoint for the second substrate based on the second in-situ monitoring system.

11. The method of claim 8 , wherein the second in-situ monitoring system comprises one or more of a motor torque monitoring system, an eddy current monitoring system, a friction monitoring system, or a monochromatic optical monitoring system.

12. A computer program product for generating reference, tangible encoded in a non-transitory computer readable medium, comprising instructions for causing a processor to:
polishing a first substrate in a polishing apparatus having a rotatable platen;
receive, from a first in-situ monitoring system, a first sequence of spectra measured from a first substrate during polishing of the first substrate;
associate each spectrum in the first sequence of spectra with an index value equal to a number of platen rotations at which the each spectrum was measured;
store the first sequence of spectra as reference spectra;
receive data from a second in-situ monitoring system that monitors the first substrate during polishing of the first substrate;
detect a polishing endpoint of the first substrate during polishing of the first substrate based on data received from the second in-situ monitoring system and without accessing data from the first in-situ monitoring system to detect the polishing endpoint;
determine a target index value based on the number of platen rotations at the time the polishing endpoint is detected by the second in-situ monitoring system;
polishing a second substrate in the polishing apparatus;
receive, from the first in-situ monitoring system not from the second in-situ monitoring system, a second sequence of spectra measured from the second substrate during polishing of the second substrate; and
adjust a polishing parameter for at least one zone on the second substrate to adjust a polishing rate of the at least one zone based on the reference spectra, the second sequence of spectra, and the target index value.

13. The computer program product of claim 12 , wherein the target index value is the number of platen rotations at the time the second in-situ monitoring system detects the polishing endpoint of the first substrate.

14. The computer program product of claim 12 , further comprising instructions to:
for each measured spectrum in the second sequence of spectra, determine a best matching reference spectrum from the reference spectra to generate a sequence of best-matching reference spectra;
generate a sequence of index values using index values associated with the best matching reference spectra; and
fit a linear function to the sequence of index values.

15. The computer program product of claim 14 , further comprising instructions to:
determine a projected time at which the linear function will reach the target index value; and
trigger an endpoint based at the time that the linear function reaches the target index value.

Assignees

• Qian Jun
• Lee Harry Q
• Applied Materials Inc

Inventors

• Qian Jun
• Lee Harry Q

Classifications

• B24B49/12

  involving optical means · CPC title

• B24B49/045

  Specially adapted gauging instruments · CPC title

• B24B37/205

  provided with a window for inspecting the surface of the work being lapped · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title