Method for processing a workpiece and processing device

Patent metadata

Field	Value
Publication number	US-9579749-B2
Application number	US-201414149962-A
Country	US
Kind code	B2
Filing date	Jan 8, 2014
Priority date	Jul 13, 2011
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A method for processing a workpiece with a processing device which has a processing head which can be moved at a defined speed and distance from a surface of the workpiece, the method comprising at least partially detecting a surface topography of the workpiece to be processed, determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and a trailing spacing of the processing head associated with the defined speed, and processing the workpiece with the processing head at the established minimum desired operating distance of the processing head from the workpiece.

First claim

The invention claimed is:

1. A method for processing a workpiece with a processing device that has a processing head that can be moved at a defined speed and distance from a surface of the workpiece, the method comprising:
at least partially detecting a surface topography of the workpiece to be processed;
subsequently determining a minimum desired operating distance of the processing head from the workpiece with reference to the detected surface topography of the workpiece and determining a trailing spacing of the processing head associated with the defined speed, wherein the minimum desired operating distance is determined with a defined safety allowance sufficient to reliably prevent collisions of the processing head with the workpiece, and wherein additional operating parameters of the processing device are adjusted in accordance with the determined minimum desired operating distance; and
processing the workpiece with the processing head at the determined minimum desired operating distance of the processing head from the workpiece.

2. The method according to claim 1 , wherein the surface topography of the workpiece to be processed is detected in a contact-free manner.

3. The method according to claim 1 , wherein the surface topography of the workpiece to be processed is detected in a tactile manner.

4. The method according to claim 1 , comprising scanning the workpiece at a preliminary desired operating distance of the processing head from the workpiece with a sensor system to detect the surface topography of the workpiece in a surface detection region which is arranged at least partially upstream of a respective processing location on the workpiece in a movement direction of the processing head along a predetermined desired operating path.

5. The method according to claim 4 , wherein at least partially detecting a surface topography of the workpiece comprises moving the surface detection region simultaneously with the processing head along the desired processing path.

6. The method according to claim 1 , wherein at least partially detecting a surface topography of the workpiece comprises
scanning the workpiece at a preliminary desired operating distance of the processing head from the workpiece, and
adjusting a respective operating distance of the processing head from the workpiece to the preliminary desired operating distance with reference to control signals or with reference to distance adjustment movements of the processing head with respect to the workpiece.

7. The method according to claim 6 , wherein the distance adjustment movements are calculated by determining acceleration values of the processing head and/or paths of the processing head travelled along at least one movement axis.

8. The method according to claim 1 , wherein the trailing spacing of the processing head is determined before the workpiece is processed.

9. The method according to claim 1 , wherein the trailing spacing of the processing head is established during the processing of the workpiece.

10. The method according to claim 1 , wherein the safety allowance is sized in accordance with the previously detected surface topography of the workpiece and/or the previously established trailing spacing of the processing head.

11. The method according to claim 1 , wherein the predetermined minimum desired distance is used to adjust operating parameters of the processing device.

12. A processing device for processing a workpiece having a processing head that can be moved at a defined speed and distance from a workpiece to be processed, comprising:
a sensor system for detecting a surface topography of the workpiece; and
a control unit for controlling the movement of the processing head with respect to the workpiece, wherein the control device is programmed to:
move the processing head at a defined speed and distance from a surface of the workpiece,
at least partially detect a surface topography of the workpiece,
subsequently determine a minimum desired operating distance of the processing head from the workpiece with reference to the previously detected surface topography of the workpiece and determine a trailing spacing of the processing head associated with the defined speed, wherein the minimum desired operating distance is determined with a defined safety allowance sufficient to reliably prevent collisions of the processing head with the workpiece, and wherein additional operating parameters of the processing device are adjusted in accordance with the determined minimum desired operating distance, and
process the workpiece with the processing head at the determined minimum desired operating distance of the processing head from the workpiece.

13. The processing device according to claim 12 , wherein the sensor system has a spacing sensor for measuring an operating distance of the processing head from the workpiece.

14. The processing device according to claim 12 , wherein the processing head has a nozzle for a process fluid.

15. The processing device according to claims 12 , wherein the processing device is a laser processing device.

Assignees

• Trumpf Werkzeugmaschinen Gmbh Co Kg

Inventors

• Hammann Gerhard

Classifications

• B23K26/048 Primary

  by controlling the distance between laser head and workpiece · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K26/04 Primary

  Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light · CPC title

• B23K26/03 Primary

  Observing, e.g. monitoring, the workpiece · CPC title