Prepreg, metal-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9578734-B2
Application number	US-201314355141-A
Country	US
Kind code	B2
Filing date	Sep 19, 2013
Priority date	Sep 28, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000:

wherein X:Y=0:1 to 0.35:0.65, R 1 represents H or CH 3 , and R 2 represents H or an alkyl group.

First claim

The invention claimed is:

1. A prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state,
the resin composition comprising:
(A) an epoxy resin and a phenolic curing agent; and
(B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value falling within a range of 0.2 to 0.7 ep/kg, and a weight-average molecular weight falling within a range of 260,000 to 850,000:

and, wherein:
X:Y=0:1 to 0.35:0.65, R 1 represents H or CH 3 , and R 2 represents H, a methyl group, an ethyl group or a butyl group,
the fabric substrate is a fabric in which a warp thread and a weft thread are woven so as to be almost perpendicular to each other,
at least one of the epoxy resin and the phenolic curing agent has a naphthalene skeleton, and
a ratio of a loss elastic modulus to a storage elastic modulus in each of temperature ranges of not greater than 60° C. and not less than 231° C. of the prepreg is 0.05 or more when the resin composition is in a fully-cured state.

2. The prepreg according to claim 1 , wherein the resin composition further comprises an inorganic filler as a component (C).

3. The prepreg according to claim 1 , wherein the ratio of a loss elastic modulus to a storage elastic modulus in each of temperature ranges of 38 ° C. to 49 ° C. and 231 ° C. to 271 ° C. of the prepreg is 0.05 or more when the resin composition is in a fully-cured state.

4. The prepreg according to claim 1 , wherein a tensile elongation percentage along an oblique direction at 45 degrees to the warp thread or the weft thread of the fabric substrate of the prepreg is 5.1% to 10.1% when the resin composition is in a fully-cured state.

5. A metal-clad laminate, comprising:
the prepreg according to claim 1 ; and
metal foil on the prepreg.

6. A printed wiring board, comprising the metal-clad laminate according to claim 5 being formed to have a patterned conductor.

7. The prepreg according to claim 1 , wherein the resin composition comprises 34.33 to 48.06 parts by mass of the epoxy resin based on 100 parts by mass of a total amount of the component (A) and the component (B).

8. The prepreg according to claim 1 , wherein the resin composition comprises 15.67 to 29.32 parts by mass of the phenolic curing agent based on 100 parts by mass of a total amount of the component (A) and the component (B).

9. The prepreg according to claim 1 , wherein a mass ratio of the component (A) to the component (B) ranges from 70:30 to 50:50.

10. The prepreg according to claim 2 , wherein an amount of the component (C) is 62.5 wt% or less, based on a total amount of the resin composition.

11. The prepreg according to claim 2 , wherein the component (C) is spherical silica.

12. The prepreg according to claim 1 , wherein the resin composition further comprises a curing accelerator.

13. The prepreg according to claim 12 , wherein the curing accelerator is a imidazole.

14. The prepreg according to claim 1 , wherein the fabric substrate is a glass cloth.

15. The prepreg according to claim 3 , wherein:
the ratio of a loss elastic modulus to a storage elastic modulus is a loss tangent, and
the loss tangent has one peak in each of temperature ranges of 38 ° C. to 49 ° C. and 231 ° C. to 271 ° C. when the resin composition is in a fully-cured state.

16. The metal-clad laminate according to claim 5 , wherein the metal foil is copper foil.

17. A sub-package comprising:
the printed wiring board according to claim 6 ; and
a semiconductor device mounted on the printed wiring board and enclosed.

18. A package on package comprising the sub-packages according to claim 17 ,
wherein the sub-packages are stacked.

Assignees

• Panasonic Corp
• Panasonic Ip Man Co Ltd

Inventors

• Inoue Hiroharu
• Kishino Koji

Classifications

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• C08G59/621

  Phenols · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• C08J2433/02

  Homopolymers or copolymers of acids; Metal or ammonium salts thereof · CPC title