Support mount for electronic components

US9578429B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9578429-B2
Application numberUS-55809606-A
CountryUS
Kind codeB2
Filing dateNov 9, 2006
Priority dateNov 9, 2006
Publication dateFeb 21, 2017
Grant dateFeb 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

For the cushioned support of electronic components in a mounting enclosure of a miniaturized electronic device, an elastic and/or flexible retaining element ( 15 ) with inward-protruding support sections ( 17 ) extends along at least parts of the inner wall of the mounting enclosure ( 3 ), serving to position, support and retain the component ( 1 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. Method for producing a system for cushioned support of an electronic component ( 1 ) in a multi-part mounting enclosure ( 3 ) of a miniaturized electronic device, the system comprising an elastic and/or flexible retaining element ( 15 ) that extends along a portion of an inner wall of a plurality of separate enclosure portions that collectively form an exterior periphery of the mounting enclosure ( 3 ) and are provided with inward-protruding support sections ( 17 ) serving to position and retain the electronic component ( 1 ) within the mounting enclosure ( 3 ), the method comprising forming a at least one of the enclosure portions of the mounting enclosure ( 3 ) for the electronic component ( 1 ) together with the retaining element ( 15 ) comprising the support sections ( 17 ) in a single molding operation by utilizing a two-component injection-molding technique to bond the retaining element to the at least one of the enclosure portions of the mounting enclosure ( 3 ), during which the retaining element ( 15 ) and the support sections ( 17 ) are molded from a thermoplastic elastomer. 2. Method for producing a system as in claim 1 , characterized in that a bond between the support sections ( 17 ) and the mounting enclosure ( 3 ) for the electronic component ( 1 ) couples at least two different materials together, each of said different materials comprising a different hardness.

Assignees

Inventors

Classifications

  • mechanically · CPC title

  • H04R25/604Primary

    of acoustic or vibrational transducers · CPC title

  • Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles (ear wax retarders, e.g. mounting thereof H04R25/654) · CPC title

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Frequently asked questions

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What does patent US9578429B2 cover?
For the cushioned support of electronic components in a mounting enclosure of a miniaturized electronic device, an elastic and/or flexible retaining element ( 15 ) with inward-protruding support sections ( 17 ) extends along at least parts of the inner wall of the mounting enclosure ( 3 ), serving to position, support and retain the component ( 1 ).
Who is the assignee on this patent?
Karamuk Erdal, Sonova Ag
What technology area does this patent fall under?
Primary CPC classification H04R25/604. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).