Pluggable LGA socket for high density interconnects

Patent metadata

Field	Value
Publication number	US-9577361-B2
Application number	US-201414520530-A
Country	US
Kind code	B2
Filing date	Oct 22, 2014
Priority date	Oct 22, 2014
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

In some embodiments, an apparatus includes a land grid array connector positioned above an electrical package. The apparatus also includes a channel housing positioned above the land grid array. The apparatus includes an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing. A gap of the tapered opening decreases progressively starting from the opening of the socket. A conductive wedge positioned in the gap of the tapered opening.

First claim

What is claimed is:

1. An apparatus comprising:
a land grid array connector positioned above an electrical package;
a channel housing positioned above the land grid array connector;
an electrical-to-optical transceiver positioned in an opening of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the channel housing, wherein a gap of the tapered opening decreases progressively starting from the opening of the channel housing; and
a conductive wedge, separate from the electrical-to-optical transceiver, for inserting above the electrical-to-optical transceiver in the channel housing, wherein the conductive wedge is positioned in the gap of the tapered opening.

2. The apparatus of claim 1 , further comprising a conductive lid positioned above the electrical-to-optical transceiver and below the conductive wedge.

3. The apparatus of claim 2 , wherein the conductive lid comprises at least one lid extension.

4. The apparatus of claim 3 , wherein the channel housing comprises a channel housing rail that includes at least one slot, wherein the at least one lid extension is placed in the at least one slot.

5. The apparatus of claim 1 , wherein an alignment hole is vertically aligned in the channel housing and an engage button is positioned on top of the conductive wedge.

6. The apparatus of claim 1 , wherein the channel housing comprises attachment railings to secure the channel housing to the electrical package.

7. The apparatus of claim 1 , wherein the conductive wedge causes a downward force to be applied to the electrical-to-optical transceiver, wherein the downward force provides electrical connection between the electrical-to-optical transceiver and the land grid array connector.

8. The apparatus of claim 1 , and wherein the conductive wedge, when inserted in the channel housing, provides a thermal heat dissipation path away from the electrical-to-optical transceiver.

Assignees

• IBM

Inventors

• Benner Alan F
• Fasano Benjamin Vito
• Fortier Paul Francis
• Toy Hilton T

Classifications

• H01R12/774 Primary

  Retainers · CPC title

• H01R12/772

  Strain relieving means · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H01R12/79

  connecting to rigid printed circuits or like structures · CPC title

• H01R4/5083 Primary

  using a wedge · CPC title