Display apparatus and method of manufacturing the same
US-2024419215-A1 · Dec 19, 2024 · US
US9577146B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9577146-B2 |
| Application number | US-201514695131-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2015 |
| Priority date | Apr 24, 2015 |
| Publication date | Feb 21, 2017 |
| Grant date | Feb 21, 2017 |
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A light-emitting element comprises: a first semiconductor stack having a first conductivity type; an active layer formed on the first semiconductor stack; a second semiconductor stack having a second conductivity type formed on the active layer; and a first current-spreading layer having the first conductivity type interposed in the second semiconductor stack.
Opening claim text (preview).
What is claimed is: 1. A light-emitting element comprising: a first semiconductor stack having a first conductivity type; an active layer formed on the first semiconductor stack; a second semiconductor stack having a second conductivity type formed on the active layer; and a first current-spreading layer having the first conductivity type interposed in the second semiconductor stack; wherein the second semiconductor stack comprises an electron-blocking layer formed between the active layer and the first current-spreading layer. 2. The light-emitting element according to claim 1 , wherein the first semiconductor stack, the active layer and the second semiconductor stack comprise nitride based semiconductor, and the first conductivity type comprises n-type, and the second conductivity type comprises p type. 3. The light-emitting element according to claim 2 , wherein the first conductivity type of the first current-spreading layer comprises intentionally doped n-type or un-intentionally doped n-type. 4. The light-emitting element according to claim 2 , wherein the first current-spreading layer comprises an n-type GaN layer and/or the first current-spreading layer comprises a higher resistance for holes than the second semiconductor stack. 5. The light-emitting element according to claim 2 , further comprising a second current-spreading layer, being undoped or un-intentionally doped and adjacent to the first current-spreading layer, and interposed in the second semiconductor stack. 6. The light-emitting element according to claim 5 , wherein the second current-spreading layer comprises GaN or AlGaN. 7. The light-emitting element according to claim 5 , wherein the second current-spreading layer comprises a thickness between 15 Å and 40 Å. 8. The light-emitting element according to claim 5 , wherein the second current-spreading layer is closer to the active layer than the first current-spreading layer. 9. The light-emitting element according to claim 5 , wherein the second current-spreading layer has an Al composition between 10% and 20%. 10. The light-emitting element according to claim 1 , wherein the first current-spreading layer comprises a thickness between 50 Å and 100 Å. 11. The light-emitting element according to claim 1 , wherein the second semiconductor stack comprises an upper side and a bottom side closer to the active layer than the upper side, and the first current-spreading layer is closer to the bottom side than the upper side. 12. A light-emitting element comprising: a semiconductor light-emitting stack; a p-type semiconductor stack formed in the semiconductor light-emitting stack; and a first current-spreading layer comprising an undoped layer interposed in the p-type semiconductor stack; wherein the undoped layer comprises an un-intentionally doped layer. 13. The light-emitting element according to claim 12 , wherein the semiconductor light-emitting stack comprises an n-type semiconductor stack, an active layer formed on the n-type semiconductor stack and the p-type semiconductor stack formed on the active layer. 14. The light-emitting element according to claim 12 , wherein the first current-spreading layer comprises GaN or AlxGa1-xN, and x is between 0.1 and 0.2 and/or the first current-spreading layer comprises a thickness between 15 Å and 40 Å or between 50 Å and 100 Å. 15. The light-emitting element according to claim 13 , wherein the p-type semiconductor stack comprises an electron-blocking layer formed between the active layer and the first current-spreading layer. 16. The light-emitting element according to claim 15 , wherein the electron-blocking layer comprises AlGaN and the first current-spreading layer comprises AlGaN, and an Al composition of the electron-blocking layer is higher than that of the first current-spreading layer. 17. The light-emitting element according to claim 13 , further comprising a second current-spreading layer, being undoped or un-intentionally doped and adjacent to the first current-spreading layer, and interposed in the p-type semiconductor stack. 18. The light-emitting element according to claim 17 , wherein the second current-spreading layer comprises GaN or AlGaN. 19. The light-emitting element according to claim 17 , wherein the second current-spreading layer is closer to the active layer than the first current-spreading layer. 20. The light-emitting element according to claim 13 , wherein the p-type semiconductor stack comprises an upper side and a bottom side closer to the active layer than the upper side, and the first current-spreading layer is closer to the bottom side than the upper side.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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