CMOS compatible ultraviolet sensor device and method of producing a CMOS compatible ultraviolet sensor device

Patent metadata

Field	Value
Publication number	US-9577135-B2
Application number	US-201415028010-A
Country	US
Kind code	B2
Filing date	Sep 30, 2014
Priority date	Oct 10, 2013
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

The ultraviolet sensor device comprises a semiconductor substrate, a dielectric layer above the substrate, a surface of the dielectric layer that is provided for the incidence of ultraviolet radiation, a floating gate electrode in the dielectric layer and an electrically conductive control gate electrode near the floating gate electrode. The control gate electrode is insulated from the floating gate electrode. A sensor layer is formed by an electrically conductive further layer that is electrically conductively connected to the floating gate electrode. The control gate electrode is arranged outside a region that is located between the sensor layer and the surface provided for the incidence of ultraviolet radiation. The sensor layer is discharged by incident UV radiation and can be charged or discharged electrically by charging or discharging the floating gate electrode.

First claim

The invention claimed is:

1. An ultraviolet sensor device, comprising:
a semiconductor substrate;
a dielectric layer above the substrate, a surface of the dielectric layer being provided for the incidence of ultraviolet radiation;
a floating gate electrode in the dielectric layer; and
a control gate electrode near the floating gate electrode, the control gate electrode being insulated from the floating gate electrode;
a sensor layer being formed by an electrically conductive further layer ( 17 , 20 ) connected to the floating gate electrode; and
the control gate electrode being arranged outside a region that is located between the sensor layer and the surface provided for the incidence of ultraviolet radiation.

2. The ultraviolet sensor device of claim 1 , wherein the floating gate electrode comprises a polysilicon layer, and the control gate electrode is a doped well in the substrate.

3. The ultraviolet sensor device of claim 2 , further comprising:
a further doped well in the substrate near the floating gate electrode;
an oxide layer between the doped well and the floating gate electrode; and
a further oxide layer between the further doped well and the floating gate electrode, wherein
the oxide layer is thicker than the further oxide layer.

4. The ultraviolet sensor device of claim 2 , wherein the sensor layer is formed by a further polysilicon layer, which is electrically connected to the floating gate electrode.

5. The ultraviolet sensor device of claim 1 , further comprising:
the sensor layer is formed by a metal plate, which is electrically connected to the floating gate electrode and is arranged under the surface provided for the incidence of ultraviolet radiation.

6. The ultraviolet sensor device of claim 1 , further comprising:
the floating gate electrode comprising a polysilicon layer;
the sensor layer comprising a further polysilicon layer; and
a silicide layer, which is arranged on the further polysilicon layer between the further polysilicon layer and the surface provided for the incidence of ultraviolet radiation.

7. The ultraviolet sensor device of claim 1 , wherein
the control gate electrode is a polysilicon layer; and
the floating gate electrode is a portion of a further polysilicon layer, which also forms the sensor layer.

8. The ultraviolet sensor device of claim 7 , further comprising:
a source region and a drain region formed in the substrate;
a channel region in the substrate between the source region and the drain region; and
the further polysilicon layer being arranged above the channel region.

9. The ultraviolet sensor device of claim 8 , further comprising:
a dielectric interlayer between the channel region and the further polysilicon layer;
the floating gate electrode overlying the control gate electrode at least partially.

10. The ultraviolet sensor device of claim 1 , wherein
the control gate electrode is a metal layer arranged in the vicinity of the sensor layer.

11. A method of producing an ultraviolet sensor device, comprising:
applying a polysilicon layer on or above a semiconductor substrate;
embedding the polysilicon layer in a dielectric layer, which comprises a surface provided for the incidence of ultraviolet radiation;
producing an electrically conductive control gate electrode;
applying a further polysilicon layer or a metal layer and embedding the further polysilicon layer or the metal layer in the dielectric layer, so that a sensor layer is formed and the control gate electrode is arranged outside a region that is located between the sensor layer and the surface provided for the incidence of ultraviolet radiation, and forming a floating gate electrode by arranging the polysilicon layer in the vicinity of the control gate electrode and electrically connecting the polysilicon layer to the sensor layer or by arranging the further polysilicon layer in the vicinity of the control gate electrode.

12. The method according to claim 11 , further comprising:
forming the control gate electrode by a doped well in the substrate.

13. The method according to claim 11 , further comprising:
forming the sensor layer by a metal layer, which is arranged under the surface provided for the incidence of ultraviolet radiation and is electrically connected to the polysilicon layer.

14. The method according to claim 11 , further comprising:
the control gate electrode being produced from the polysilicon layer;
the floating gate electrode being formed by the further polysilicon layer; and
a dielectric interlayer being arranged between the polysilicon layer and the further polysilicon layer.

15. The method according to claim 14 , further comprising:
forming a source region and a drain region in the substrate with a channel region between the source region and the drain region; and
the dielectric interlayer and the further polysilicon layer being arranged above the channel region.

Assignees

• Ams Ag

Inventors

• Leisenberger Friedrich Peter

Classifications

• H10P14/416

  of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title

• H01L27/14632

  Electricity · mapped topic

• H01L29/788

  Electricity · mapped topic

• H01L31/09 Primary

  Electricity · mapped topic

• H01L27/14614

  Electricity · mapped topic