On-chip terahertz thin-film devices
US-2024429627-A1 · Dec 26, 2024 · US
US9576916B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9576916-B2 |
| Application number | US-201213543050-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2012 |
| Priority date | Jul 8, 2011 |
| Publication date | Feb 21, 2017 |
| Grant date | Feb 21, 2017 |
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A high frequency circuit includes a first electronic device, a second electronic device, and a graphene interconnection unit, where at least one of a trench and a via is defined under the graphene interconnection unit.
Opening claim text (preview).
What is claimed is: 1. A high frequency circuit comprising: a first electronic device; a second electronic device, wherein each of the first and second electronic devices comprise a transistor; and a graphene interconnection unit which electrically connects and directly contacts the first and second electronic devices; and an insulating layer having a trench disposed under the graphene interconnection unit, wherein the trench has an opening portion, wherein the opening portion only extends partially through a thickness of the insulating layer, the graphene interconnection unit covers at least part of the opening portion, the graphene interconnection unit consists of solely of graphene which is disposed in the form of one graphene monolayer to 300 graphene monolayers, and the graphene has a planar structure in which carbon atoms are aligned in a hexagonal ring to form a honeycomb structure. 2. The high frequency circuit of claim 1 , wherein the first electronic device sends an electrical signal to the second electronic device via the graphene interconnection unit in a high frequency field. 3. The high frequency circuit of claim 1 , wherein the trench has a depth in the range of about 1 nanometer to about 10,000 nanometers. 4. The high frequency circuit of claim 1 , wherein the first electronic device sends an electrical signal via the graphene interconnection unit at a frequency of about 0.8 gigahertz or higher. 5. The high frequency circuit of claim 1 , wherein the first electronic device sends an electrical signal via the graphene interconnection unit at a frequency in a range of about 2 gigahertz to about 300 terahertz. 6. The high frequency circuit of claim 1 , wherein the graphene interconnection unit comprises a plurality of graphene units aligned substantially parallel to each other. 7. The high frequency circuit of claim 1 , wherein the graphene interconnection unit conveys a current at a frequency in a range of about 1 megahertz to about 800 mega hertz. 8. The high frequency circuit of claim 1 , wherein the graphene interconnection unit conveys a current at a frequency in a range of about 2 gigahertz to about 300 gigahertz. 9. The high frequency circuit of claim 1 , wherein the high frequency circuit is a radio frequency circuit which operates at a high frequency of about 0.8 gigahertz or greater. 10. A method of operating the high frequency circuit according to claim 1 , the method comprising: applying a power voltage to the high frequency circuit comprising the graphene interconnection unit; and conveying current via the graphene interconnection unit in a high frequency field, wherein the trench is defined under the graphene interconnection unit. 11. The high frequency circuit of claim 1 , wherein the graphene has a width in a range of about 0.001 micrometer to about 1 millimeter and a length in a range of about 0.001 micrometer to about 100 micrometers.
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