Electronic component and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9576722-B2
Application number	US-201414227111-A
Country	US
Kind code	B2
Filing date	Mar 27, 2014
Priority date	Mar 28, 2013
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A coil component 1 includes a thin-film coil layer including spiral conductors and bump electrodes 12 a to 12 d formed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodes 24 a to 24 d connected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layer 15 d covering the internal terminal electrode 24 a to 24 d and having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodes 24 a to 24 d are exposed through the corresponding opening. The bump electrodes 12 a to 12 d are each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodes 24 a to 24 d in the corresponding opening.

First claim

What is claimed is:

1. An electronic component comprising:
a conductor layer including a first terminal electrode;
an insulating layer covering at least a top surface of the conductor layer and having an opening, the opening having an extended portion running outward over a periphery of the first terminal electrode in a plan view and both at least a part of a top surface and at least a part of an outer peripheral side surface of the first terminal electrode being positioned inside the opening; and
a second terminal electrode formed on at least a top surface of the insulating layer and embedded in the opening so as to be connected to both the part of the top surface and the part of the outer peripheral side surface of the first terminal electrode through the opening.

2. The electronic component as claimed in claim 1 , further comprising:
a substrate; and
a thin-film coil layer formed on the substrate and having the conductor layer and the insulating layer, wherein
the conductor layer further includes a planar coil pattern connected to the first terminal electrode,
the first terminal electrode is an internal terminal electrode of the thin-film coil layer, and
the second terminal electrode is an external terminal electrode formed on a surface of the thin-film coil layer.

3. The electronic component as claimed in claim 2 , wherein the internal terminal electrode has at least a first outer peripheral side surface parallel to a longitudinal direction of the substrate and at least a second outer peripheral side surface parallel to a direction perpendicular to the longitudinal direction, and at least one of the first and second outer peripheral side surfaces is positioned inside the opening.

4. The electronic component as claimed in claim 3 , wherein both the first and second outer peripheral side surfaces are positioned inside the opening.

5. The electronic component as claimed in claim 2 , wherein
the thin-film coil layer has a multi-layered structure in which a plurality of the conductor layers and a plurality of the insulating layers are alternately stacked,
the opening is formed in an uppermost one of the insulating layers, and
both the top and outer peripheral side surfaces of the first terminal electrode formed in an uppermost one of the conductor layers are positioned inside the opening.

6. The electronic component as claimed in claim 2 ,
wherein
the thin-film coil layer has a multi-layered structure in which a plurality of the conductor layers and a plurality of the insulating layers are alternately stacked,
the opening is formed in each of the insulating layers, and
both the top and outer peripheral side surfaces of the first terminal electrode formed in each of the conductor layers are positioned inside the opening.

7. A manufacturing method of an electronic component comprising:
forming a conductor layer including a first terminal electrode;
forming an insulating layer covering the first terminal electrode;
forming an opening in the insulating layer so that the opening has an extended portion running outward over a periphery of the first terminal electrode in a plan view and both at least a part of a top surface and at least a part of an outer peripheral side surface of the first terminal electrode are exposed through the opening; and
forming a second terminal electrode on the insulating layer and embedded in the opening so that the second terminal electrode is in contact with both the part of the top surface and the part of the outer peripheral side surface of the first terminal electrode through the opening.

8. The manufacturing method of the electronic component as claimed in claim 7 , further comprising:
forming a thin-film coil layer including a planar coil pattern on a substrate; and
forming an external terminal electrode on the thin-film coil layer, wherein
the forming the thin-film coil layer includes the forming the conductor layer, the insulating layer and the opening,
the first terminal electrode is an internal terminal electrode of the planar coil pattern, and
the second terminal electrode is the external terminal electrode.

9. An electronic component comprising:
a substrate;
a thin-film coil layer formed on the substrate; and
an external terminal electrode formed on a top surface of the thin-film coil layer, wherein the thin-film coil layer includes:
a first conductor layer including a planar coil pattern and a first internal terminal electrode;
a first insulating layer covering the first conductor layer and having a first opening, at least a top surface of the first internal terminal electrode being positioned inside the first opening;
a second conductor layer including a second internal terminal electrode formed on the first insulating layer so that the second internal terminal electrode is connected to the top surface of the first internal terminal electrode through the first opening; and
a second insulating layer covering the second conductor layer and having a second opening, the second opening having an extended portion running outward over a periphery of the second internal electrode in a plan view and both at least part of a top surface and at least a part of an outer peripheral side surface of the second internal terminal electrode being positioned inside the second opening, and
the external terminal electrode is formed on the second insulating layer and embedded in the second opening so as to be connected to both the part of the top surface and the part of the outer peripheral side surface of the second internal terminal electrode through the second opening.

10. The electronic component as claimed in claim 9 , wherein an outer peripheral side surface of the first internal terminal electrode is positioned inside the first opening and the external terminal electrode is connected to the outer peripheral side surface of the first internal terminal electrode through the second and first openings.

11. The electronic component as claimed in claim 9 , wherein the planar coil pattern is a spiral conductor and an outer peripheral end of the spiral conductor is connected to the first internal electrode.

12. The electronic component as claimed in claim 9 , wherein the planar coil pattern is a spiral conductor,
the thin-film coil layer further includes a lead conductor formed in the second conductor layer and a through-hole conductor passing through the first insulating layer,
one end of the lead conductor is connected to the second internal terminal electrode, and
the other end of the lead conductor is connected to an inner peripheral end of the spiral conductor through the through-hole conductor.

Assignees

• Tdk Corp

Inventors

• Watanabe Fumio
• Ishikawa Naozumi
• Kamiyama Hiroshi

Classifications

• C25D5/022

  using masking means · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H01F41/042

  by thin film techniques · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F27/29 Primary

  Terminals; Tapping arrangements {for signal inductances} · CPC title