Downhole fluid resistivity sensor systems and methods

US9575199B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9575199-B2
Application numberUS-201214388193-A
CountryUS
Kind codeB2
Filing dateMar 28, 2012
Priority dateMar 28, 2012
Publication dateFeb 21, 2017
Grant dateFeb 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is a downhole fluid resistivity sensor that includes a ceramic cylinder having a fluid-contacting surface, and at least four metal pins that penetrate a wall of the ceramic cylinder at axially-spaced locations. The pins are bonded to the ceramic to form a pressure seal. The sensor may include a circuit that injects current into a fluid via an outer two of the pins, and measures a resulting voltage via an inner two of the pins. The circuit may also provide an indication of fluid resistivity based at least in part on the resulting voltage. At each of the axially-spaced locations, a set of multiple pins may penetrate the wall to contact the fluid at circumferentially-spaced positions. The fluid-contacting surface may be an inner surface or an outer surface of the ceramic cylinder. A downhole fluid resistivity measurement method is also described.

First claim

Opening claim text (preview).

What is claimed is: 1. A formation testing tool that comprises: a downhole fluid resistivity sensor having a ceramic cylinder with a fluid-contacting surface and at least four metal pins that penetrate a wall of the cylinder at axially-spaced locations, the pins being bonded to the ceramic to form a pressure seal; a probe that contacts a borehole wall; and a pump that extracts a formation fluid sample via the probe and places the fluid sample in contact with said fluid-contacting surface, wherein the tool employs the at least four metal pins to perform a four-point resistivity measurement on said fluid sample. 2. The tool of claim 1 , wherein at each of said axially-spaced locations, a set of multiple, electrically-connected pins penetrates the wall to contact the fluid sample at circumferentially-spaced positions. 3. The tool of claim 1 , wherein the fluid-contacting surface defines an inner bore of the cylinder. 4. The tool of claim 1 , wherein the fluid-contacting surface is an outer surface of the cylinder. 5. A downhole fluid resistivity sensor that comprises: a ceramic cylinder having a fluid-contacting surface; at least four metal pins that penetrate a wall of the ceramic cylinder at axially-spaced locations, the pins bonded to the ceramic to form a pressure seal. 6. The sensor of claim 5 , further comprising a circuit that injects current into a fluid via an outer two of said pins and measures a resulting voltage via an inner two of said pins, wherein the circuit further provides an indication of fluid resistivity based at least in part on said resulting voltage. 7. The sensor of claim 5 , wherein at each of said axially-spaced locations, a set of multiple pins penetrates the wall to contact the fluid at circumferentially-spaced positions. 8. The sensor of claim 7 , wherein each set of multiple pins includes at least four electrically-connected pins. 9. The sensor of claim 7 , wherein each set of multiple pins includes at least six electrically-connected pins. 10. The sensor of claim 5 , wherein the fluid-contacting surface is an outer surface of the ceramic cylinder. 11. The sensor of claim 10 , wherein the fluid-contacting surface contacts drilling fluid. 12. The sensor of claim 5 , wherein the fluid-contacting surface defines an inner bore of the cylinder. 13. The sensor of claim 5 , wherein the fluid-contacting surface contacts a formation fluid sample. 14. A downhole fluid resistivity measurement method that comprises: contacting a downhole fluid with a fluid-contacting surface of a ceramic cylinder; passing an alternating current into the downhole fluid via at least two current injection pins that penetrate a wall of the ceramic cylinder at axially-spaced current injection locations; and sensing a resulting voltage in the downhole fluid via at least two voltage sensing pins that penetrate the wall at axially-spaced locations between the current injection locations. 15. The method of claim 14 , further comprising displaying a fluid resistivity value derived at least in part from the resulting voltage. 16. The method of claim 14 , wherein each of said current injection pins is one of a set of electrically-connected pins that contact a fluid at circumferentially-spaced positions. 17. The method of claim 16 , wherein each of said voltage sensing pins is one of a set of electrically-connected pins that contact the fluid at circumferentially-spaced positions. 18. The method of claim 14 , wherein the fluid-contacting surface defines an inner bore of the cylinder, and the method further comprises providing a fluid flow through the inner bore. 19. The method of claim 14 , wherein the fluid-contacting surface is an outer surface of the ceramic cylinder and the method further comprising immersing the cylinder in a downhole fluid.

Assignees

Inventors

Classifications

  • G01V3/02Primary

    operating with propagation of electric current · CPC title

  • Obtaining fluid samples or testing fluids, in boreholes or wells · CPC title

  • G01V3/20Primary

    operating with propagation of electric current · CPC title

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Frequently asked questions

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What does patent US9575199B2 cover?
Disclosed is a downhole fluid resistivity sensor that includes a ceramic cylinder having a fluid-contacting surface, and at least four metal pins that penetrate a wall of the ceramic cylinder at axially-spaced locations. The pins are bonded to the ceramic to form a pressure seal. The sensor may include a circuit that injects current into a fluid via an outer two of the pins, and measures a resu…
Who is the assignee on this patent?
Zhang Wei, Zhang Lizheng, Gao Li, and 2 more
What technology area does this patent fall under?
Primary CPC classification G01V3/02. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).