Sensor temperature sensing device

Patent metadata

Field	Value
Publication number	US-9574947-B2
Application number	US-201414183202-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Jun 23, 2010
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

The present disclosure includes sensing device embodiments. One sensing device includes a heater layer, a resistance detector layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, an electrode layer, and a sensing layer.

First claim

What is claimed:

1. A sensing device, comprising:
a heater layer;
a thermocouple detector layer constructed and arranged to indicate a temperature value based upon a correlation to a detected thermoelectric voltage value, wherein the thermocouple detector layer is adjacent to the heater layer;
a sensing layer; and
an electrode layer between the sensing layer and the thermocouple detector layer.

2. The sensing device of claim 1 , wherein the sensing device is configured to sense change in a gas environment indicative of a fire being present.

3. The sensing device of claim 1 , wherein the device provides 400 degrees C. of heat at 20 mW during operating sensing conditions.

4. The sensing device of claim 1 , wherein the device performs at a power to heat ratio of 1 mW/20 degrees C.

5. The sensing device of claim 1 , wherein the heater layer, the thermocouple detector layer, the electrode layer, and the sensing layer can be placed in various orders, but each layer overlaps with each neighboring layer to more than 50% overlap, and no pair of the layers are placed side by side.

6. A sensing device comprising:
a nickel chromium heater layer;
a thermocouple detector layer, having a layered structure comprised of two dissimilar conductive materials, wherein the thermocouple detector layer is adjacent to the heater layer;
a metal oxide semiconductor sensing layer of chromium titanium oxide or tungsten oxide; and
an electrode layer between the metal oxide semiconductor sensing layer and the thermocouple detector layer.

7. The sensing device of claim 6 , wherein the semi-conductive material layer is formed from a silicon based material.

8. The sensing device of claim 6 , wherein at least one of the conductive material layers is formed from platinum or chromium.

9. A sensing device comprising:
a nickel chromium heater layer;
an electrode layer;
a serpentine shaped resistance detector layer between the heater layer and the electrode layer, constructed and arranged to indicate a temperature value based upon a correlation to a detected resistance value, wherein the resistance detector layer has a layered structure including a semi-conductive material layer between two conductive material layers; and
a chromium titanium oxide sensing layer adjacent to the electrode layer.

10. The sensing device of claim 9 , wherein the serpentine shaped resistance detector layer is formed utilizing platinum.

11. The sensing device of claim 9 , wherein the heater is controlled to maintain an operating temperature of approximately 300-400 degrees C.

12. The sensing device of claim 9 , wherein the electrode layer is formed utilizing at least one of platinum, chromium titanium oxide, and gold.

13. A sensing device, comprising:
a heater layer;
a thermocouple detector layer constructed and arranged to indicate a temperature value based upon a correlation to a detected thermoelectric voltage value, wherein the thermocouple detector layer includes a nickel/iron layer and a chromium layer, and wherein the thermocouple detector layer is adjacent to the heater layer;
a sensing layer; and
an electrode layer between the sensing layer and the thermocouple detector layer.

14. The sensing device of claim 13 , wherein the heater layer is comprised of nickel chromium.

Assignees

• Honeywell Int Inc

Inventors

• Cole Barrett E
• Higashi Robert E
• Tobias Peter

Classifications

• G01N27/123

  for controlling the temperature (temperature control per se G05D23/00) · CPC title

• G01K7/02 Primary

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01K7/028 Primary

  using microstructures, e.g. made of silicon · CPC title

• G01K7/186

  using microstructures · CPC title