Mounting bracket for heat dissipation device having fins

Patent metadata

Field	Value
Publication number	US-9574830-B2
Application number	US-201213430016-A
Country	US
Kind code	B2
Filing date	Mar 26, 2012
Priority date	Mar 26, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.

First claim

What is claimed is:

1. A heat dissipation device, comprising: an L-shaped mounting bracket having a first portion, a second portion and a third portion, the first portion having at least one retaining hole, and the second portion having a mounting section; and
a thermal module including a plurality of discrete radiating fins, to which the mounting bracket is connected; and on the radiating fins, at least one engaging cut out being provided extending inward from an outer edge of an open lateral side of a portion of the fins for correspondingly engaging with the mounting bracket, and at least one locking tab portion being formed on a side of the engaging cut out for correspondingly engaging with the at least one retaining hole of the mounting bracket;
wherein the mounting bracket is inserted into the engaging cut out on the thermal module from the open lateral side of the radiating fins while the mounting section of the mounting bracket is exposed and protruded out of one end of the thermal module for connecting the heat dissipation device to an electronic element; and wherein the mounting bracket further has at least one stopper portion at the third portion adapted to be inserted in between two adjacent radiating fins to thereby stabilize the location of the mounting bracket.

2. The heat dissipation device as claimed in claim 1 , wherein the locking portion is brought to engage with the retaining hole on the mounting bracket by way of mechanical processing.

3. The heat dissipation device as claimed in claim 2 , wherein the mechanical processing is stamping.

4. The heat dissipation device as claimed in claim 1 , wherein the mounting bracket is inserted into the engaging cut out on the thermal module from an end surface of the assembled radiating fins.

Assignees

• Lin Sheng-Huang
• Chu Yen-Lin
• Asia Vital Components Co Ltd

Inventors

• Lin Sheng-Huang
• Chu Yen-Lin

Classifications

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• F28D15/0275 Primary

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• B23P15/26

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• F28F1/32

  the means having portions engaging further tubular elements · CPC title

• F28F9/00 Primary

  Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings · CPC title