Honeycomb structure

Patent metadata

Field	Value
Publication number	US-9574473-B2
Application number	US-201514633543-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Mar 4, 2014
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

There is provided a honeycomb structure where a crack at honeycomb segments, which constitute a honeycomb bonded assembly, is reduced. A honeycomb structure has a pillar-shaped honeycomb bonded assembly that has a plurality of pillar-shaped honeycomb segments having a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and a bonding layer bonding side surfaces of the plurality of honeycomb segments, and in the honeycomb bonded assembly, at 25 to 800° C., a thermal expansion coefficient of the bonding layer is larger than a thermal expansion coefficient of the honeycomb segment.

First claim

What is claimed is:

1. A honeycomb structure, comprising:
a pillar-shaped honeycomb bonded assembly that has a plurality of honeycomb segments having a porous partition wall defining a plurality of cells, the cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and a bonding layer bonding side surfaces of the plurality of honeycomb segments to one another,
wherein the thermal expansion coefficient of the bonding layer and the thermal expansion coefficient of the honeycomb segment of the honeycomb bonded assembly at 25 to 800° C. meet a relationship represented by Expression: 1.3<(the thermal expansion coefficient of the bonding layer/the thermal expansion coefficient of the honeycomb segment)<40.

2. The honeycomb structure according to claim 1 , wherein the bonding layer contains mica, or the bonding layer contains alumina and at least one kind selected from the group consisting of alumina fiber, calcined mica and a bio-soluble fiber.

3. The honeycomb structure according to claim 2 , wherein the honeycomb segment contains at least one kind selected from the group consisting of silicon carbide, alumina titanate, silicon nitride and cordierite.

4. The honeycomb structure according to claim 3 , further comprising an outer circumference coating layer at an outer circumference of the honeycomb bonded assembly,
wherein, at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb segment of the honeycomb bonded assembly, and, at 25 to 800° C., a thermal expansion coefficient of the bonding layer and the thermal expansion coefficient of the outer circumference coating layer of the honeycomb bonded assembly meet a relationship represented by Expression: 0.7<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the bonding layer).

5. The honeycomb structure according to claim 2 , further comprising an outer circumference coating layer at an outer circumference of the honeycomb bonded assembly,
wherein, at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb segment of the honeycomb bonded assembly, and, at 25 to 800° C., a thermal expansion coefficient of the bonding layer and the thermal expansion coefficient of the outer circumference coating layer of the honeycomb bonded assembly meet a relationship represented by Expression: 0.7<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the bonding layer).

6. The honeycomb structure according to claim 1 , wherein the honeycomb segment contains at least one kind selected from the group consisting of silicon carbide, alumina titanate, silicon nitride and cordierite.

7. The honeycomb structure according to claim 6 , further comprising an outer circumference coating layer at an outer circumference of the honeycomb bonded assembly,
wherein, at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb segment of the honeycomb bonded assembly, and, at 25 to 800° C., a thermal expansion coefficient of the bonding layer and the thermal expansion coefficient of the outer circumference coating layer of the honeycomb bonded assembly meet a relationship represented by Expression: 0.7<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the bonding layer).

8. The honeycomb structure according to claim 1 , further comprising an outer circumference coating layer at an outer circumference of the honeycomb bonded assembly,
wherein, at 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb segment of the honeycomb bonded assembly, and, at 25 to 800° C., a thermal expansion coefficient of the bonding layer and the thermal expansion coefficient of the outer circumference coating layer of the honeycomb bonded assembly meet a relationship represented by Expression: 0.7<(the thermal expansion coefficient of the outer circumference coating layer/the thermal expansion coefficient of the bonding layer).

9. The honeycomb structure according to claim 1 , wherein the total area of the bonding layer in a cross section perpendicular to the cell extending direction of the honeycomb structure is 0.5 to 15% of the total area of the honeycomb bonded assembly.

Assignees

• Ngk Insulators Ltd

Inventors

• Ito Mitsuhiro

Classifications

• F01N3/0222 Primary

  the structure being monolithic, e.g. honeycombs · CPC title

• Y10T428/24149

  Honeycomb-like · CPC title

• C04B2235/3217

  Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina · CPC title

• C04B14/324

  Silicon carbide · CPC title

• C04B2237/365

  Silicon carbide · CPC title