Aluminum alloy material, aluminum alloy structure, and manufacturing method for same

US9574253B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9574253-B2
Application numberUS-201214361740-A
CountryUS
Kind codeB2
Filing dateOct 1, 2012
Priority dateDec 2, 2011
Publication dateFeb 21, 2017
Grant dateFeb 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An aluminum alloy material contains Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mm 2 or more to 7×10 5 pcs/mm 2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material, while 100 pcs/mm 2 to 7×10 5 pcs/mm 2 of Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material. An aluminum alloy structure is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material to a total mass of the aluminum alloy material is 5% or more and 35% or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A fin member for a heat exchanger comprising an aluminum alloy material consisting essentially of Si: 1.5 mass % to 3.5 mass % and Fe: 0.01 mass % to 2.0 mass % and at least one of Ti: in an amount of >0 and ≦0.3 mass %, V: in an amount of >0 and ≦0.3 mass %, Cr: in an amount of >0 and ≦0.3 mass %, Ni: in an amount of >0 and ≦2.0 mass %, and Zr: in an amount of >0 and ≦0.3 mass %, Zn: in an amount of >0 and ≦6.0 mass %, In: in an amount of >0 and ≦0.3 mass %, and Sn: in an amount of >0 and ≦0.3 mass %, Be: in an amount of >0 and ≦0.1 mass %, Sr: in an amount of >0 and ≦0.1 mass %, Bi: in an amount of >0 and ≦0.1 mass %, Na: in an amount of >0 and ≦0.1 mass %, and Ca: in an amount of >0 and ≦0.05 mass %, with the balance being Al and inevitable impurities, wherein 1.3×10 3 pcs/mm 2 or more to 2.2×10 4 pcs/mm 2 or less of Si-based intermetallic compound particles, each of which has equivalent circle diameters of 0.5 to 5 μm and is selected from Si alone and Si partly containing elements of Ca and P, are present in a cross-section of the aluminum alloy material, wherein 1.3×10 3 pcs/mm 2 or more to 3.3×10 4 pcs/mm 2 or less of dispersed particles of Al-based intermetallic compounds, each of which has equivalent circle diameters of 0.5 to 5 μm and is generated from Al and additive elements selected from Al—Fe-based and Al—Fe—Si-based compounds, are present in a cross-section of the aluminum alloy material, and wherein the aluminum alloy is heat bonded at a temperature at which a liquid phase ratio is 5% or more and 35% or less, with a single layer without the use of a brazing filler metal. 2. The fin member for a heat exchanger according to claim 1 , wherein a layer containing Zn is formed on a surface of the aluminum alloy material. 3. A manufacturing method for an aluminum alloy structure in which two or more members are bonded to each other, wherein the aluminum alloy material according to claim 1 is used as at least one of the two or more members, and the two or more members are bonded in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material used as at least one of the two or more members to a total mass of the relevant aluminum alloy material is 5% or more and 35% or less. 4. The manufacturing method for the aluminum alloy structure according to claim 3 , wherein the two or more members are bonded in a time of 30 sec or longer to 3600 sec or shorter during which the ratio of the mass of the liquid phase generated in the aluminum alloy material used as at least one of the two or more members to the total mass of the relevant aluminum alloy material is 5% or more. 5. A manufacturing method for an aluminum alloy structure in which two or more members are bonded to each other, wherein the aluminum alloy material according to claim 1 is used as at least one of the two or more members, and the two or more members are bonded in a vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material used as at least one of the two or more members to a total mass of the relevant aluminum alloy material is 5% or more and 35% or less. 6. The aluminum alloy structure according to claim 5 , wherein, in at least one cross-section of the two or more bonded members, 10 to 3000 pcs/mm 2 of eutectic structures having a length of 3 μm or more are present within matrix crystal grains. 7. The manufacturing method for the aluminum alloy structure according to claim 5 , wherein the two or more members are bonded in a time of 30 seconds or longer to 3600 seconds or shorter during which the ratio of the mass of the liquid phase generated in the aluminum alloy material used as at least one of the two or more members to the total mass of the relevant aluminum alloy material is 5% or more. 8. An aluminum alloy structure, in which the fin member for a heat exchanger according to claim 1 , and one or more members comprising the aluminum alloy material according to claim 1 or an aluminum alloy material different from the aluminum alloy material according to claim 1 are bonded to each other, wherein, in a metal structure in a cross-section of at least the fin member for a heat exchanger bonded in at least one bonding portion, the number of triple points of grain boundaries where Si-based intermetallic compounds and Al-based intermetallic compounds, having equivalent circle diameters of 1 μm or more, exist is 50% or more of the number of triple points of all the grain boundaries. 9. The aluminum alloy structure according to claim 8 , wherein at least one of the fin member for a heat exchanger bonded and the one or more members comprising the aluminum alloy material according to claim 1 or an aluminum alloy material different from the aluminum alloy material according to claim 1 has a layer containing Zn on a surface thereof. 10. The aluminum alloy structure according to claim 8 , wherein the aluminum alloy structure constitutes a heat exchanger in which a fin member for a heat exchanger and one or more members selected from a tube member, a plate member, and a tank member are bonded to each other. 11. A fin member for a heat exchanger having a heat bonding ability with a single layer comprising an aluminum alloy material consisting essentially of Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass %, at least one of Mg: in an amount of >0 and ≦2.0 mass %, Cu: in an amount of >0 and ≦1.5 mass %, and Mn: in an amount of >0 and ≦2.0 mass %, and at least one of Ti: in an amount of >0 and ≦0.3 mass %, V: in an amount of >0 and ≦0.3 mass %, Cr: in an amount of >0 and ≦0.3 mass %, Ni: in an amount of >0 and ≦2.0 mass %, and Zr: in an amount of >0 and ≦0.3 mass %, with the balance being Al and inevitable impurities, wherein the contents (mass %) of Si, Fe and Mn are denoted by S, F, and M, respectively and a relational expression of 1.2≦S−0.3(F+M)≦3.5 is satisfied, wherein 1.3×10 3 pcs/mm 2 or more to 2.2×10 4 pcs/mm 2 or less of Si-based intermetallic compound particles, each of which has equivalent circle diameters of 0.5 to 5 μm and is selected from Si alone and Si partly containing elements of Ca and P, are present in a cross-section of the aluminum alloy material, and wherein 1.3×10 3 pcs/mm 2 or more to 3.3×10 4 pcs/mm 2 or less of dispersed particles of Al-based intermetallic compounds, each of which has equivalent circle diameters of 0.5 to 5 μm and is generated from Al and additive elements selected from Al—Fe-based, Al—Fe—Si-based, Al—Mn—Si-based, Al—Fe—Mn-based and Al—Fe—Mn—Si-based compounds, are present in a cross-section of the aluminum alloy material, wherein the aluminum alloy material is heat bonded with a single layer without the use of a brazing filler metal, wherein the fin is bonded to a second member in at least one bonding portion, wherein, in a metal structure in a cross-section of the at least one bonding portion, a number of triple points of grain boundaries where Si-based intermetallic compounds and Al-based intermetallic compounds both having equivalent circle diameters of 1 μm or more exist, is 50% or more of the number of triple points of all the grain boundaries. 12. The fin member for a heat exchanger according to claim 11 , wherein the aluminum alloy material further consists essentially of at least one of Zn: in an amount of >0 and ≦6.0 mass %, In: in an amount of >0 and ≦0.3 mass %, and Sn: in an amount of >0 and ≦0.3 mass %. 13. The fin member for a heat exchanger according to claim 11 , wherein the aluminum alloy material further consists essentially

Assignees

Inventors

Classifications

  • consisting of zig-zag shaped fins (F28F1/105 takes precedence) · CPC title

  • C22C21/18Primary

    with zinc · CPC title

  • C22C21/02Primary

    with silicon as the next major constituent · CPC title

  • from aluminium or aluminium alloys · CPC title

  • Next to Al-base component · CPC title

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What does patent US9574253B2 cover?
An aluminum alloy material contains Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mm 2 or more to 7×10 5 pcs/mm 2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material, while 100 pcs/mm 2 to 7×10 5 p…
Who is the assignee on this patent?
Uacj Corp
What technology area does this patent fall under?
Primary CPC classification C22C21/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).