Composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layer

Patent metadata

Field	Value
Publication number	US-9574108-B2
Application number	US-201414259845-A
Country	US
Kind code	B2
Filing date	Apr 23, 2014
Priority date	Aug 8, 2013
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product that includes a structural unit represented by the following Chemical Formula 1:

First claim

What is claimed is:

1. A composition for forming a silica-based insulation layer, the composition comprising:
a solvent; and
an organosilane-based condensation polymerization product that includes a structural unit represented by the following Chemical Formula 1:

wherein, in the above Chemical Formula 1,
R 1 includes hydrogen, a hydroxy group, a C1 to C4 alkyl group, a C6 to C20 aryl group, a vinyl group, or a combination thereof,
R 2 to R 4 each independently include hydrogen, a hydroxy group, a C1 to C20 alkoxy group, a halogen-containing group, a silicon-containing group, or a combination thereof, provided that the repeating unit bracketed by x is different from the repeating unit bracketed by y,
m is an integer of 1 to 6, and
x, y, and z represent a relative mole ratio of each repeating unit, and satisfy the following relations: 0.05≦x≦0.50, 0.45≦y≦0.90, 0.05≦z≦0.50, and x+y+z=1.

2. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein the organosilane-based condensation polymerization product has a weight average molecular weight (Mw) of about 3,000 to about 20,000.

3. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein the organosilane-based condensation polymerization product is included in an amount of about 0.1 wt % to about 50 wt %, based on a total weight of the composition.

4. The composition for forming a silica-based insulation layer as claimed in claim 1 , further comprising a thermal acid generator.

5. A silica-based insulation layer prepared from the composition for forming a silica-based insulation layer as claimed in claim 1 .

6. The silica-based insulation layer as claimed in claim 5 , wherein the insulation layer has a dielectric constant (k) of about 1.9 to about 3.5.

7. The silica-based insulation layer as claimed in claim 5 , wherein the insulation layer has a modulus (E) of about 4 GPa to about 18 GPa.

8. A method of manufacturing a silica-based insulation layer, the method comprising
coating the composition for forming a silica-based insulation layer as claimed in claim 1 on a substrate;
drying the substrate coated with the composition for forming a silica-based insulation layer; and
curing the resultant at about 200° C. or more under an inert gas atmosphere.

9. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein, in Chemical Formula 1, R 1 includes a hydroxy group, a C1 to C4 alkyl group, a C6 to C20 aryl group, a vinyl group, or a combination thereof.

10. A method of forming a silica based insulating layer, the method comprising:
reacting trialkoxysilane, bis(trialkoxy)silylalkane, and alkyltrialkoxysilane by a condensation reaction
spin-coating the resultant in layer on a substrate, and
heat curing the spin-coated layer.

11. A silica-based insulation layer prepared from the method as claimed in claim 10 .

Assignees

• Park Eun-Su
• Kwak Taek-Soo
• Na Yoong-Hee
• Song Hyun-Ji
• Lee Han-Song
• Hong Seung-Hee
• Cheil Ind Inc

Inventors

• Park Eun-Su
• Kwak Taek-Soo
• Na Yoong-Hee
• Song Hyun-Ji
• Lee Han-Song
• Hong Seung-Hee

Classifications

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6686

  the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• C08L83/02

  Polysilicates · CPC title

• H01B17/62

  Insulating-layers or insulating-films on metal bodies · CPC title