Resin composition, resin film, and electronic device

Patent metadata

Field	Value
Publication number	US-9574090-B2
Application number	US-201414913474-A
Country	US
Kind code	B2
Filing date	Aug 25, 2014
Priority date	Aug 27, 2013
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

First claim

The invention claimed is:

1. A resin composition comprising a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein
a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A).

2. The resin composition according to claim 1 wherein a content of the alkoxysilyl group-containing (meth)acrylate compound (B) is 0.25 to 4 parts by weight with respect to 100 parts by weight of the binder resin (A).

3. The resin composition according to claim 1 wherein a content of the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.25 to 7 parts by weight with respect to 100 parts by weight of the binder resin (A).

4. The resin composition according to claim 1 containing, as the tetrafunctional or higher functional (meth)acrylate compound (C), tetrafunctional or higher functional (meth)acrylate compounds with different numbers of functional groups in combination.

5. The resin composition according to claim 1 further comprising an epoxy group-containing (meth)acrylate compound (E).

6. The resin composition according to claim 5 wherein a content of the epoxy group-containing (meth)acrylate compound (E) is 0.5 to 5 parts by weight with respect to 100 parts by weight of the binder resin (A).

7. The resin composition according to claim 1 wherein the binder resin (A) is a cyclic olefin polymer having a protonic polar group (A1), acrylic resin (A2), Cardo resin (A3), polysiloxane (A4), or polyimide (A5).

8. The resin composition according to claim 1 wherein the photopolymerization initiator (D) is a radical generating type photopolymerization initiator, and
a content of the photopolymerization initiator (D) is 0.3 to 8 parts by weight with respect to 100 parts by weight of the binder resin (A).

9. A resin film obtained using the resin composition according to claim 1 .

10. An electronic device comprising the resin film according to claim 9 .

Assignees

• Zeon Corp

Inventors

• Shindo Hiroaki

Classifications

• C08F220/20

  of polyhydric alcohols or phenols {, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate} · CPC title

• C08F222/1025

  of aromatic dialcohols · CPC title

• C08F230/08

  containing silicon · CPC title

• C08F2/48

  by ultraviolet or visible light · CPC title

• C08F283/14

  on to polymers obtained by ring-opening polymerisation of carbocyclic compounds having one or more carbon-to-carbon double bonds in the carbocyclic ring, i.e. polyalkeneamers {(C08F283/004 takes precedence)} · CPC title