Epoxy-resin composition, and film, prepreg and fiber-reinforced plastic using the same

Patent metadata

Field	Value
Publication number	US-9574081-B2
Application number	US-201314413545-A
Country	US
Kind code	B2
Filing date	Aug 20, 2013
Priority date	Aug 20, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

The present invention relates to an epoxy-resin composition comprising the following components (A), (B), (C) and (D), a film made of the epoxy resin composition, a prepreg and a fiber-reinforced plastic. The present invention can provide an epoxy-resin composition that cures at a low temperature in a short period of time. Also, the present invention can provide a fiber-reinforced plastic having excellent mechanical characteristics, especially excellent fracture toughness and heat tolerance, is made from the epoxy-resin composition.
component (A): an epoxy resin having a monomer unit represented by formula (1) in the molecule; component (B): a bifunctional epoxy resin with a number-average molecular weight of at least 600 but no greater than 1300, which does not have a monomer unit represented by formula (1) below in the molecule; component (C): a triblock copolymer; and component (D): a curing agent.

First claim

What is claimed is:

1. An epoxy-resin composition, comprising:
component (A): an epoxy resin comprising a monomer unit represented by formula (1) obtained by a process comprising reacting epoxy resin (X), which has an average 1.8 to 2.5 epoxy groups per molecule and has an epoxy equivalent of 500 or less, with amine compound (Y), which has at least one monomer unit represented by formula (1);
component (B): a bifunctional epoxy resin with a number-average molecular weight of at least 600 but no greater than 1300, which does not have a monomer unit represented by formula (1);
component (C): a triblock copolymer; and
component (D): a curing agent:

2. The epoxy-resin composition according to claim 1 , wherein component (B) is a bisphenol-type bifunctional epoxy resin.

3. The epoxy-resin composition according to claim 1 , wherein a content of component (A) is 3 to 55 mass % of a total mass of the epoxy resin in the epoxy-resin composition.

4. The epoxy-resin composition according to claim 1 , wherein component (C) is a triblock copolymer of poly(methyl methacrylate)/poly(butyl acrylate)/poly(methyl methacrylate).

5. The epoxy-resin composition according to claim 1 , wherein component (C) is a triblock copolymer copolymerized with dimethylacrylamide.

6. The epoxy-resin composition according to claim 5 , wherein a polymerization proportion of dimethylacrylamide in the triblock compolymer copolymerized with dimethylacrylamide is 10 to 15 mass % in terms of polymerization material with respect to a total mass of the triblock copolymer copolymerized with dimethylacrylamide.

7. The epoxy-resin composition according to claim 1 , wherein component (D) is dicyandiamide.

8. The epoxy-resin composition according claim 7 , further comprising:
component (E): a urea-based curing aid.

9. The epoxy-resin composition according to claim 1 , further comprising:
component (F): an epoxy resin which is a liquid form at 30° C.

10. The epoxy-resin composition according to claim 9 , wherein component (F) does not have a monomer unit represented by formula (1) has a viscosity of 1000 Pa·s or lower at 30° C.

11. The epoxy-resin composition according to claim 10 , wherein component (F) is a bisphenol A bifunctional epoxy resin.

12. The epoxy-resin composition according to claim 8 , wherein component (E) is 3-phenyl-1, 1 -dimethylurea or toluene bis dimethyl urea.

13. The epoxy-resin composition according to claim 1 , wherein with respect to a total mass of epoxy resin in the epoxy-resin composition,
a content of component (A) is 3 to 55 mass %,
a content of component (B) is 45 to 97 mass %,
a total content of components (A) and (B) does not exceed 100 mass %,
a content of component (C) is 4 to 11 parts by mass based on 100 parts by mass of the epoxy resin in the epoxy-resin composition, and
component (D) is dicyandiamide and a content of dicyandiamide is 1 to 25 parts by mass based on 100 parts by mass of the epoxy resin in the epoxy-resin composition.

14. The epoxy-resin composition according to claim 9 , wherein with respect to a total mass of epoxy resin in the epoxy-resin composition,
a content of component (A) is 3 to 55 mass %,
a content of component (B) is 8 to 55 mass %,
a content of component (F) is 20 to 60 mass %,
a total content of components (A), (B) and (F) does not exceed 100 mass %,
a content of component (C) is 4 to 11 parts by mass based on 100 parts by mass of the epoxy resin in the epoxy-resin composition, and
component (D) is dicyandiamide and a content of dicyandiamide is 1 to 25 parts by mass based on 100 parts by mass of the epoxy resin in the epoxy-resin composition.

15. The epoxy-resin composition according to claim 13 , wherein component (D) is dicyandiamide, and the content of component (D) in the epoxy-resin composition is set so that a molar number of active hydrogen in dicyandiamide is 0.6 to 1.0 times a total molar number of epoxy groups in the epoxy resin in the epoxy-resin composition.

16. A film, comprising: the epoxy-resin composition according to claim 1 .

17. A prepreg produced by a method comprising:
impregnating reinforcing fiber material with the epoxy-resin composition according to claim 1 .

18. A fiber-reinforced plastic, comprising: reinforcing fiber and a cured product of the epoxy-resin composition according to Claim 1 .

19. The epoxy-resin composition according to claim 14 , wherein component (D) is dicyandiamide, and the content of component (D) in the epoxy-resin composition is set so that a molar number of active hydrogen in dicyandiamide is 0.6 to 1.0 times a total molar number of epoxy groups in the epoxy resin in the epoxy-resin composition.

Assignees

• Mitsubishi Rayon Co

Inventors

• Ishimoto Tomoko
• Kaneko Manabu
• Watanabe Kenichi
• Fukuhara Yasuhiro
• KITA Sanae

Classifications

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/1477

  containing nitrogen · CPC title

• C08J2453/00

  Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers · CPC title