Alkali-soluble resin (ASR) shell epoxy RDP with divalent metal ions exhibiting improved powder redispersibility

US9574053B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9574053-B2
Application numberUS-201314414265-A
CountryUS
Kind codeB2
Filing dateJul 10, 2013
Priority dateJul 12, 2012
Publication dateFeb 21, 2017
Grant dateFeb 21, 2017

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  5. First independent claim

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Abstract

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The present invention provides multilayer polymer redispersible powder (RDP) particles comprising a major proportion of from 50 to 90 wt. %, preferably, from 60 to 85 wt. %, based on total polymer solids, of epoxy resin resins having a calculated glass transition temperature (Tg) of from 0 to 40° C., a methacrylic acid containing alkali soluble polymer outer layer, and a divalent metal, such as zinc powder, having an aqueous pKa of 9.55 or more, or its acid salt having a pH of 7.0 or less, such as strong acid salts, e.g., chlorides, sulfates or phosphates, or organic acid salts, e.g., acetates, succinates and citrates, as well as to methods of making the same.

First claim

Opening claim text (preview).

We claim: 1. A redispersible polymer powder composition comprising as powder multilayer polymer particles of (i) from 50 to 90 wt. %, based on total polymer solids, of epoxy resin compositions having a calculated glass transition temperature (calculated Tg) of from 0 to 40° C., and (ii) from 10 to 50 wt. %, based on polymer solids, of an alkali soluble polymer shell around the epoxy resin, which polymer shell is the copolymerized product of from 5 to 40 wt. % of methacrylic acid or its anhydride, based on the total weight of monomers copolymerized to form the polymer shell, and the remainder of one or more ethylenically unsaturated comonomer, and (iv) an additive chosen from a divalent metal ion (M 2+ ) having a pKa of 9.55 or higher and its strong acid having a pKa of less than 3.5 or organic acid salt having a pH in water of 7.0 or less, wherein the molar ratio of M 2+ ions to the carboxyl groups from the copolymerized methacrylic acid or its anhydride in the alkali soluble resin shell is from 10 to 200 mole %. 2. The redispersible polymer powder composition as claimed in claim 1 , wherein the epoxy resin composition (i) is a blend of two or more epoxy resins. 3. The redispersible polymer powder composition as claimed in claim 1 , wherein the calculated Tg of the epoxy resin composition (i) is from 5 to 35° C. 4. The redispersible polymer powder composition as claimed in claim 1 , wherein the amount of the epoxy resin composition (i) in the multilayer polymer particle ranges from 60 to 85 wt. %, based on polymer solids. 5. The redispersible polymer powder composition as claimed in claim 1 , wherein the alkali soluble polymer that comprises the polymer shell of the multilayer polymer particle has a calculated Tg of from 60° C. to 120° C. 6. The redispersible polymer powder composition as claimed in claim 1 , further comprising (iii) from 3 to 25 wt. % of one or more colloidal stabilizer, based on total epoxy resin, alkali soluble polymer and colloidal stabilizer solids. 7. The redispersible polymer powder composition as claimed in claim 1 , wherein the divalent metal ion is chosen from calcium, zinc, barium and magnesium. 8. The redispersible polymer powder composition as claimed in any preceding claim 1 wherein the pH of the additive in water is 7.0 or less. 9. A composition comprising cement or hydraulic binder and the redispersible polymer powder composition as claimed in claim 1 . 10. A method for making a water dispersible epoxy multilayer polymer particle powder comprising: mechanically dispersing an epoxy resin in an aqueous medium to form an initial aqueous epoxy resin dispersion; charging the initial aqueous epoxy resin dispersion into a reaction vessel; providing in the reaction vessel an ethylenically unsaturated monomer mixture comprising (i) from 5 to 40 wt. % of methacrylic acid or its anhydride and (ii) the remainder of one or more copolymerizable ethylenically unsaturated monomers, each based on the total weight of ethylenically unsaturated monomers copolymerized to form the polymer shell, and one or more addition polymerization catalyst; copolymerizing the monomer mixture in the presence of the initial aqueous epoxy resin dispersion to form an aqueous multilayer polymer particle dispersion; adding an additive chosen from a divalent metal ion (M 2+ ) having a pKa of 9.55 or higher and its strong acid having a pKa of less than 3.5 or organic acid salt having a pH in water of 7.0 or less to the aqueous multilayer polymer particle dispersion; and, removing the aqueous phase from the resulting multilayer polymer to obtain a water redispersible epoxy polymer powder having an alkali soluble polymer shell, wherein the amounts of epoxy resin and unsaturated monomers are selected so that the resulting water redispersible epoxy polymer powder has from 50 to 90 wt. % of epoxy resin, based on total polymer solids. 11. The process as claimed in claim 10 , wherein the ethylenically unsaturated monomer mixture is added by gradual addition to the reaction vessel containing the initial aqueous epoxy resin dispersion.

Assignees

Inventors

Classifications

  • containing hydraulic cements other than calcium sulfates · CPC title

  • Homopolymers or copolymers of acids; Metal or ammonium salts thereof · CPC title

  • Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

  • Polyepoxides · CPC title

  • added as redispersable powders · CPC title

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What does patent US9574053B2 cover?
The present invention provides multilayer polymer redispersible powder (RDP) particles comprising a major proportion of from 50 to 90 wt. %, preferably, from 60 to 85 wt. %, based on total polymer solids, of epoxy resin resins having a calculated glass transition temperature (Tg) of from 0 to 40° C., a methacrylic acid containing alkali soluble polymer outer layer, and a divalent metal, such as…
Who is the assignee on this patent?
Dow Global Technologies Llc, Rohm & Haas
What technology area does this patent fall under?
Primary CPC classification C08J3/126. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).