Coating apparatus and method of forming coating film

Patent metadata

Field	Value
Publication number	US-9573144-B2
Application number	US-201414291575-A
Country	US
Kind code	B2
Filing date	May 30, 2014
Priority date	May 30, 2014
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

A method of forming a coating film over a substrate is provided. The method includes spinning the substrate. The method further includes providing a central coating liquid spray over a central portion of the substrate. The method also includes providing first coating liquid sprays over the substrate. The first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by a same first distance.

First claim

What is claimed is:

1. A method of forming a coating film over a substrate, comprising:
spinning the substrate;
providing a central coating liquid spray over a central portion of the substrate;
providing a plurality of first coating liquid sprays over the substrate, wherein the first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same first distance; and
providing a plurality of second coating liquid sprays on the substrate, wherein the second coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same second distance, wherein the second distance is greater than the first distance.

2. The method of forming a coating film over a substrate as claimed in claim 1 , wherein the providing of the first coating liquid sprays is performed after the providing of the central coating liquid spray.

3. The method of forming a coating film over a substrate as claimed in claim 1 , wherein a flow time of the central coating liquid spray is longer than a flow time of the first coating liquid spray.

4. The method of forming a coating film over a substrate as claimed in claim 1 , wherein the providing of the central coating liquid spray, the providing of the first coating liquid sprays, and the providing of the second coating liquid sprays are performed sequentially.

5. The method of forming a coating film over a substrate as claimed in claim 1 , wherein a flow time of the central coating liquid spray is longer than a flow time of the first coating liquid spray, and the flow time of the first coating liquid spray is longer than a flow time of the second coating liquid spray.

6. The method of forming a coating film over a substrate as claimed in claim 1 , wherein a flow rate of the central coating liquid spray is greater than a flow rate of the first coating liquid spray.

7. The method of forming a coating film over a substrate as claimed in claim 6 , wherein the flow rate of the first coating liquid spray is greater than a flow rate of the second coating liquid spray.

8. The method of forming a coating film over a substrate as claimed in claim 1 , wherein a flow rate of the central coating liquid spray is greater than a flow rate of the first coating liquid spray.

9. A method of forming a coating film over a substrate, comprising:
spinning the substrate;
providing a central coating liquid spray over a central portion of the substrate;
providing a plurality of first coating liquid sprays over the substrate, wherein the first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same first distance, and a central coating liquid supply quantity of the central coating liquid spray is greater than a sum of coating liquid supply quantities of the first coating liquid sprays; and
providing a plurality of second coating liquid sprays on the substrate, wherein the second coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same second distance, and the second distance is greater than the first distance.

10. The method of forming a coating film over a substrate as claimed in claim 9 , wherein the sum of coating liquid supply quantities of the first coating liquid sprays is greater than a sum of coating liquid supply quantities of the second coating liquid sprays.

11. The method of forming a coating film over a substrate as claimed in claim 9 , wherein a ratio of the central coating liquid supply quantity of the central coating liquid spray to a sum of coating liquid supply quantities of the first coating liquid sprays and the second coating liquid sprays ranges from about 2 to about 9.

12. The method of forming a coating film over a substrate as claimed in claim 9 , wherein the providing of the central coating liquid spray, the providing of the first coating liquid sprays, and the providing of the second coating liquid sprays are performed sequentially.

13. The method of forming a coating film over a substrate as claimed in claim 9 , wherein a flow time of the central coating liquid spray is longer than a flow time of the first coating liquid spray, and the flow time of the first coating liquid spray is longer than a flow time of the second coating liquid spray.

14. The method of forming a coating film over a substrate as claimed in claim 9 , wherein a flow rate of the central coating liquid spray is greater than a flow rate of the first coating liquid spray.

15. A method of forming a coating film over a substrate, comprising:
spinning the substrate;
providing a central coating liquid spray over a central portion of the substrate;
providing a plurality of first coating liquid sprays over the substrate, wherein the first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same first distance, and the first coating liquid sprays are at substantially a same first angular distance from one another with respect to the central coating liquid spray; and
providing a plurality of second coating liquid sprays over the substrate, wherein the second coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by substantially a same second distance, and the second distance is greater than the first distance.

16. The method of forming a coating film over a substrate as claimed in claim 15 , wherein the substrate is in a circular shape and has a radius, and the first distance is greater than a half of the radius.

17. The method of forming a coating film over a substrate as claimed in claim 15 , wherein a first number of second coating liquid sprays is greater than a second number of the first coating liquid sprays.

18. The method of forming a coating film over a substrate as claimed in claim 15 , wherein the second coating liquid sprays are at substantially a same second angular distance from one another with respect to the center coating liquid spray.

19. The method of forming a coating film over a substrate as claimed in claim 15 , wherein a first flow rate of the central coating liquid spray is greater than a second flow rate of the first coating liquid spray, and the second flow rate of the first coating liquid spray is greater than a third flow rate of the second coating liquid spray.

20. The method of forming a coating film over a substrate as claimed in claim 15 , wherein the first distance is greater than a difference between the second distance and the first distance.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Wang Lan-Hai
• Yang Yong-Hung
• Liu Ding-I
• Liao Si-Wen
• Leu Po-Hsiung
• Lin mao-cheng

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• B05B1/185

  characterised by their outlet element; Mounting arrangements therefor · CPC title

• B05B1/30 Primary

  designed to control volume of flow, e.g. with adjustable passages {(B05B11/0094 takes precedence)} · CPC title

• H01L21/6715

  Electricity · mapped topic