Circuit device and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9572294-B2
Application number	US-201113882952-A
Country	US
Kind code	B2
Filing date	Oct 12, 2011
Priority date	Nov 4, 2010
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders ( 19 ), which are apart from each other, are firstly formed on the upper surface of a pad ( 18 A), and a chip component ( 14 B) and a transistor ( 14 C) are affixed at the same time. After that, a solder paste ( 31 ) is supplied to the upper surface of the pad ( 18 A) using a syringe ( 30 ), a heatsink ( 14 D) is mounted on top of the solder paste ( 31 ), and melting is caused by a reflow process. There is little risk of sinking of the solders ( 19 ) in the present invention since the solders ( 19 ) are discretely arranged on the upper surface of the pad ( 18 A).

First claim

The invention claimed is:

1. A method of manufacturing a circuit device, comprising the steps of:
providing a substrate having a pad formed thereon, the pad having an upper surface;
forming a plurality of portions of a first solder on the upper surface of the pad, the portions of the plurality of portions of the first solder being spaced away from each other so that they can maintain a discretized state even after they are melted, and wherein the portions of first solder are arranged as an array of elements laterally positioned in rows and columns on the upper surface of the pad; and
heating the plurality of portions of the first solder to melt the portions of the plurality of portions of the first solder, wherein each portion of the plurality of portions of the first solder maintains a discretized state after melting, and wherein each portion of the plurality of portions of the first solder comprises an alloy portion having a first thickness formed vertically between a corresponding portion of the pad and a solder portion;
applying a second solder to the upper surface of the pad and the plurality of solder portions;
mounting a component to the second solder; and
heating the second solder and the discretized portions of the plurality of portions of the first solder to form an alloy layer, wherein heating the second solder increases the thickness of the alloy portions between the corresponding portions of the pad and the solder portions to a second thickness and creates another alloy portion laterally between the plurality of solder portions, the another alloy portion having a third thickness, the third thickness less than the second thickness.

2. The method for manufacturing a circuit device according to claim 1 , wherein the portions of first solder are formed directly on the upper surface of the pad, and the solder paste is applied to surfaces of the portions of first solder and the upper surface of the pad.

3. The method for manufacturing a circuit device according to claim 1 , wherein in a plan view, the portions of first solder are each formed into a quadrangular shape, each side of which is 3 mm long or shorter.

4. The method for manufacturing a circuit device according to claim 1 , wherein in the step of forming the portions of first solder, a chip element or a small-signal transistor is attached to an upper surface of the circuit substrate with solder.

5. The method for manufacturing a circuit device according to claim 1 , wherein the circuit element is a heat sink to an upper surface of which a transistor is attached.

6. The method for manufacturing a circuit device according to claim 1 , wherein forming the solder paste to the upper surface of the pad from which the plurality of portions of the first solder are absent includes supplying the solder paste with a syringe.

7. The method for manufacturing a circuit device according to claim 1 , wherein forming the solder paste to the upper surface of the pad from which the plurality of portions of the first solder are absent includes filling the gaps between the plurality of portions of first solder on an upper surface of a pad.

8. The method for manufacturing a circuit device according to claim 1 , wherein forming the solder paste to the upper surface of the pad from which the plurality of portions of the first solder are absent includes applying the solder paste to cover the portions of the first solder and the upper surface of the pad.

9. The method for manufacturing a circuit device according to claim 1 , further including placing a circuit element on an upper surface of the solder paste before melting the solder paste.

10. The method for manufacturing a circuit device according to claim 1 , further including placing a heat sink on an upper surface of the solder paste before melting the solder paste.

11. A method of manufacturing a circuit device, comprising:
providing a substrate having a pad formed thereon;
forming at least a first solder structure and a second solder structure on the pad, wherein the first solder structure is separate from the second solder structure;
heating at least the first solder structure and the second solder structure to melt at least the first solder structure and the second solder structure, wherein the melted first solder structure comprises a modified first solder structure and the melted second solder structure comprises a modified second solder structure, the modified first solder structure comprising a first alloy portion having a first thickness in contact with a first portion of the pad and a first solder portion in contact with the first alloy portion and the modified second solder structure comprising a second alloy portion having the first thickness in contact with a second portion of the pad and a second solder portion in contact with the second alloy portion, the modified first solder structure and the modified second solder structure remaining separate solder structures after melting;
forming a plurality of solder portions on the pad, the plurality solder portions laterally spaced apart from each other to expose portions of the pad;
forming a solder paste on the plurality of modified first solder portions structure, the modified second solder structure and the exposed portions of the pad; and
mounting a component of the solder paste; and
heating the solder paste to melt the solder paste, wherein the melted solder paste mixes with the plurality of modified solder structures portions to form a unitary solder structure, and wherein in response to heating the solder paste a third alloy portion having a second thickness is formed laterally on the pad and a thickness of the first alloy portion of the modified first solder structure and the second alloy portion of the second modified solder structure increases from the first thickness to a third thickness, the second thickness less than the third thickness.

12. The method of claim 11 , wherein heating the solder paste includes melting the solder paste.

13. The method of claim 11 , further including placing wherein the component is a circuit element in the solder paste before heating the solder paste.

14. The method of claim 13 , wherein the circuit element is a heat sink.

Assignees

• Onai Nobuhisa
• Motegi Masami
• Semiconductor Components Ind Llc

Inventors

• Onai Nobuhisa
• Motegi Masami

Classifications

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title