Electronic device, bonding material, and method for producing electronic device

Patent metadata

Field	Value
Publication number	US-9572255-B2
Application number	US-201414224250-A
Country	US
Kind code	B2
Filing date	Mar 25, 2014
Priority date	Sep 30, 2011
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1−T3<50° C.

First claim

The invention claimed is:

1. An electronic device comprising:
a plurality of electronic components each having two or more electrodes, wherein one electronic component and another electronic component among the plurality of electronic components are electrically connected;
a metal bonding electrodes of the one electronic component and electrodes of the other electronic component to form two or more electrode bonding parts that are electrically insulated from each other; and
a first thermosetting resin filling a gap between one of the electrode bonding parts and another of the electrode bonding parts,
wherein the electrode bonding parts are formed from a bonding material comprising:
metal particles that are melted at a first temperature T1;
a second thermosetting resin that starts to be cured at a second temperature T2 that is higher than the first temperature T1; and
an activating agent that is activated at a third temperature T3 that is lower than the second temperature T2 so as to remove an oxide layer formed on a surface of the metal particles, wherein
a viscosity of contained components except the metal particles at the first temperature T1 is 0.57 Pa·s or less, and
the first temperature T1 and the third temperature T3 satisfy T1−T3<50° C.

2. The electronic device according to claim 1 , wherein the metal contains a Sn—Bi-based alloy as a major component.

3. The electronic device according to claim 1 , wherein
the plurality of electronic components include a substrate having land electrodes and a chip-type component having external electrodes on a surface of a component element body, and
the land electrodes and the external electrodes are bonded via the metal to form the electrode bonding parts.

4. A bonding material comprising:
metal particles that are melted at a first temperature T1;
a thermosetting resin that starts to be cured at a second temperature T2 that is higher than the first temperature T1; and
an activating agent that is activated at a third temperature T3 that is lower than the second temperature T2 so as to remove an oxide layer formed on a surface of the metal particles, wherein
a viscosity of contained components except the metal particles at the first temperature T1 is 0.57 Pa·s or less, and
the first temperature T1 and the third temperature T3 satisfy T1−T3<50° C.

5. The bonding material according to claim 4 , wherein the metal particles contain a Sn—Bi-based alloy as a major component.

6. The bonding material according to claim 4 , wherein the metal particles contain a Sn—Pb-based alloy as a major component.

7. The bonding material according to claim 4 , wherein a content of the metal particles is 50 vol % or less in volume ratio.

8. The bonding material according to any claim 4 , wherein a content of the metal particles is 10 vol % or more in volume ratio.

9. The bonding material according to claim 4 , wherein a content of the metal particles is 15 vol % or more in volume ratio.

10. The bonding material according to claim 4 , wherein a volume content of the activating agent is 0.1 to 16 vol % relative to a whole of the bonding material.

11. A method for producing an electronic device having a plurality of electronic components each having two or more electrodes, wherein one electronic component and another electronic component among the plurality of electronic components are electrically connected, the method comprising:
applying the bonding material according to claim 4 onto the electrodes of the one electronic component and thereafter disposing the electrodes of the other electronic component onto the bonding material;
performing a heating treatment to melt the metal particles contained in the bonding material and to activate the activating agent contained in the bonding material to remove the oxide layer formed on the surface of the metal particles so as to bond the electrodes of the one electronic component and the electrodes of the other electronic component via the melted metal to form two or more electrode bonding parts that are electrically insulated from each other, and to fluidize the thermosetting resin contained in the bonding material so as to fill a gap between the electrode bonding parts with the thermosetting resin.

12. The method for producing an electronic device according to claim 11 , wherein the metal particles contain a Sn—Bi-based alloy as a major component.

13. The method for producing an electronic device according to claim 11 , wherein a content of the metal particles is 50 vol % or less in volume ratio.

14. The method for producing an electronic device according to any claim 11 , wherein a content of the metal particles is 10 vol % or more and 50 vol % or less in volume ratio.

15. The method for producing an electronic device according to claim 11 , wherein a content of the metal particles is 15 vol % or more and 50 vol % or less in volume ratio.

16. A method for producing an electronic device having a plurality of electronic components each of which has two or more electrodes, wherein one electronic component and another electronic component are electrically connected, the method comprising:
applying the bonding material according to claim 4 onto a surface including the electrodes of the one electronic component and thereafter disposing the other electronic component onto the bonding material, and
performing a heating treatment to melt the metal particles contained in the bonding material and to activate the activating agent contained in the bonding material to remove the oxide layer formed on the surface of the metal particles, so as to let the melted metal particles move to a site between the electrodes of the one electronic component and the electrodes of the other electronic component so as to form two or more electrode bonding parts that are electrically insulated from each other and to fill between the electrode bonding parts with the thermosetting resin contained in the bonding material.

17. The method for producing an electronic device according to claim 16 , wherein the metal particles contain a Sn—Bi-based alloy as a major component.

18. The method for producing an electronic device according to claim 16 , wherein a content of the metal particles is 50 vol % or less in volume ratio.

19. The method for producing an electronic device according to any claim 16 , wherein a content of the metal particles is 10 vol % or more and 50 vol % or less in volume ratio.

20. The method for producing an electronic device according to claim 16 , wherein a content of the metal particles is 15 vol % or more and 50 vol % or less in volume ratio.

Assignees

• Murata Manufacturing Co

Inventors

• Nomura Akihiro
• Takaoka Hidekiyo

Classifications

• H05K2201/0212

  Resin particles · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• B23K35/362

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title