Photonic package architecture

Patent metadata

Field	Value
Publication number	US-9570883-B2
Application number	US-201113976419-A
Country	US
Kind code	B2
Filing date	Dec 28, 2011
Priority date	Dec 28, 2011
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

First claim

What is claimed is:

1. A device, comprising:
a first die of semiconductor material, said first die having circuitry including a photon emitter on the front side of the first die, and a beam path on the front side of the first die and positioned to direct a beam of photons from the photon emitter on the front side of the first die, through the semiconductor material of the body of the first die, and to the backside of the first die;
a second die having a photon emitter driver circuit, said second die being coupled to the front side of the first die having the photon emitter, for driving the photon emitter;
an optical coupler positioned at the backside of the first die to receive the beam of photons from the backside of the first die; and
a heat sink thermally coupled to the backside of the first die, made of a heat drawing material and positioned to draw heat energy generated by circuitry including the photon emitter on the front side of the first die, wherein the heat sink defines a recess within the heat sink and the optical coupler is received in the heat sink recess.

2. The device of claim 1 wherein the beam path includes a first mirror on the front side of the first die and positioned to reflect a beam of photons from the photon emitter on the front side of the first die, through the semiconductor material of the body of the first die, and to the backside of the first die.

3. The device of claim 1 wherein the first die has integrated circuits including doped regions on the front side of the first die.

4. The device of claim 2 wherein the first mirror includes an etched beveled surface at the front side of the first die and a photon reflective metal on the beveled surface.

5. The device of claim 1 wherein the photon emitter is a laser.

6. The device of claim 1 wherein said the optical coupler includes a mirror positioned to reflect the beam of photons from the backside of the first die.

7. The device of claim 1 further comprising a layer of optically transmissive adhesive affixing the optical coupler to the backside of the first die.

8. The device of claim 6 wherein the optical coupler includes a lens positioned to focus the beam of photons reflected by the mirror of the optical coupler.

9. The device of claim 8 further comprising a fiber optic cable coupled to the optical coupler so that the fiber optic cable is positioned to receive the beam of photons focused by the lens of the optical coupler.

10. The device of claim 1 for use with a substrate, the device further comprising an interposer having a central aperture, said interposer coupled to the substrate.

11. The device of claim 10 wherein the front side of the first die having the photon emitter is coupled to the interposer with the second die disposed within the aperture of the interposer.

Assignees

• Zarbock Edward A
• Mallik Debendra
• Intel Corp

Inventors

• Zarbock Edward A
• Mallik Debendra

Classifications

• H10W90/00

  Package configurations · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• G02B6/4238

  Soldering · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title