Light source module and manufacturing method thereof, and backlight unit

Patent metadata

Field	Value
Publication number	US-9570424-B2
Application number	US-201414471215-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Aug 28, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A light source module includes a circuit board, light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT), and a diffusor covering the circuit board and the light emitting diode chips.

First claim

What is claimed is:

1. A light source module, comprising:
a circuit board;
light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT);
a diffusor sheet covering the circuit board and the light emitting diode chips;
a wavelength converting layer covering a top and sides of the light emitting diode chips, wherein a thickness of the wavelength converting layer on the top and the sides of the light emitting diode chips are the same; and
a reflector disposed between the light emitting diode chips,
wherein the diffusor is disposed directly on an upper surface of the reflector and an upper surface of the wavelength converting layer,
a side surface of each wavelength converting layer is connected to a corresponding reflector; and
an upper surface of the diffusor sheet is flat.

2. A light source module, comprising:
a circuit board;
light emitting diode chips mounted on the circuit board by flip-chip bonding or a surface mounting technology (SMT);
a diffusor covering the circuit board and the light emitting diode chips;
a wavelength converting layer covering a top and sides of the light emitting diode chips, wherein thicknesses of the wavelength converting layer on the top and the sides of the light emitting diode chips are the same; and
a transflective layer disposed on the wavelength converting layer, the transflective layer configured to transmit a portion of received light and reflect a remaining portion of the received light, and being formed of a thin film metal layer or a resin mixed with a reflecting material.

3. The light source module of claim 2 , further comprising an adhesive member disposed between the light emitting diode chips and contacting the circuit board.

4. The light source module of claim 3 , wherein the adhesive member comprises a reflecting material and is a film-type adhesive member.

5. The light source module of claim 3 , wherein the adhesive member comprises a reflecting layer and an adhesive layer.

6. The light source module of claim 2 , further comprising protrusions disposed on an upper surface of the diffusor.

7. The light source module of claim 6 , wherein the protrusions each have a semi-cylindrical or hemispherical shape and are spaced apart from one another on the upper surface of the diffusor.

8. The light source module of claim 6 , wherein the protrusions form a concavo-convex structure.

9. The light source module of claim 1 , further comprising bumps disposed between the light emitting diode chips and the circuit board, the bumps electrically connecting electrode pads of the light emitting diode chips and board pads of the circuit board.

10. The light source module of claim 9 , further comprising a heat radiating bump disposed between the bumps.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Nam Ki Bum
• Han Yu Dae

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title